基于载能离子束技术制备超薄无胶挠性覆铜板  

Preparation of Ultra-thin Adhesive-free Flexible Copper Clad Laminate Based on Energetic Ion Beam Technology

作　　者：张一凡 闫维卿 李倩 袁恒 沈永清 陈琳 庞盼 欧阳潇 廖斌[1] ZHANG Yi-fan;YAN Wei-qing;LI Qian;YUAN Heng;SHEN Yong-qing;CHEN Lin;PANG Pan;OUYANG Xiao;LIAO Bin(College of Nuclear Science and Technology,Beijing Normal University,Beijing 100875,China;Beijing Academy of Science and Technology,Beijing 100083,China)

机构地区：[1]北京师范大学核科学与技术学院,北京100875 [2]北京市科学技术研究院,北京100083

出　　处：《表面技术》2023年第9期313-321,共9页Surface Technology

基　　金：国家科技重大专项(J2019-Ⅷ-0003-0164)。

摘　　要：目的开发超薄的无胶二层挠性覆铜板(2L-FCCL)。方法融合MEVVA离子注入、磁过滤阴极真空弧和化学电镀技术在柔性聚酰亚胺表面构筑梯度金属化结构,并为超薄无胶二层挠性覆铜板的制备提供解决方案。结果通过XPS、ATR-FTIR光谱及反应分子动力学(ReaxFF-MD)模拟证明了Ni+注入过程中聚酰亚胺亚表层互键连网络的形成,这种离子螯合反应带来的机械互锁效应能够极大提高界面附着强度。此外,磁过滤阴极真空弧技术制备的γ(Ni-Cr)合金过渡层具有良好的柔韧性和延展性,有助于Cu膜的后续生长,并增强协同变形能力。通过45°剥离试验测得NiCr合金层与聚酰亚胺基底之间的附着强度为(1.75±0.16)N/mm,而精细化挠性覆铜线路经历1000次弯折试验后在其高变形区域未观察到裂纹萌生或线路剥落现象。结论通过MEVVA离子注入与磁过滤阴极真空弧技术的耦合可以显著提升挠性覆铜板的机械稳定性,有望应用于高端挠性覆铜板的工业化制备。Due to the advantages of lightweight,flexibility and high wiring density,flexible copper clad laminate(FCCL)provides a strategy for realizing the flexibility of microelectronic products.However,the widely used three-layer flexible copper clad laminate(3L-FCCL)has many drawbacks,such as micro defects,poor adhesion,poor thermal stability and high-speed signal loss,which can not meet the development trend of high integration,high density and high frequency in the field of microelectronics.In this work,the gradient metallization structure was fabricated on the surface of flexible polyimide based on energetic ion beam technology,which provided a solution for the preparation of ultra-thin flexible copper clad laminate.The Ni+ion implantation introduced a lot of defects on the surface of polyimide,the roughness increased from 1.33 nm to 2.14 nm,and needle-like microstructure could be detected.XPS and ATR-FTIR spectra indicated that the extensive fracture of the carbonyl(C==O)and the imide(C—N)in PMDA was accompanied by the formation of the Ni—O and Ni—N complex during the process of Ni+ion implantation.The reaction molecular dynamics(ReaxFF-MD)simulation indicated that the energy transfer caused by elastic collision was far greater than the fracture energies of carbonyl(C==O),imide(C—N)and C—H bond,which resulted in the extensive fracture of these corresponding chemical bonds.These separated N,O and H atoms became free atoms with certain kinetic energies.Subsequently,these free atoms moved to the vicinity of free radicals and formed amine(—NHR)and amide(—NHCOR)groups.In addition,it was observed that the incident Ni+ions chelated with the carbonyl(C==O)and the imide(C—N)in PMDA and formed the new Ni—N and Ni—O chelates.Due to the cascade effect,the above reactions were extended to the whole polyimide model until the kinetic energy of the system was completely dissipated.The mechanical interlocking effect stemming from the ion chelation reaction greatly improves the interfacial adhesion strength.The en

关 键 词：挠性覆铜板 离子注入 MEVVA源 磁过滤阴极真空弧 分子动力学 界面 

分 类 号：TG174.444[金属学及工艺—金属表面处理]