电镀线对陶瓷外壳寄生参数的影响研究  

Research on the Influence of Electroplating Line on the Parasitic Parameters of Ceramic Package

作　　者：张金利[1] 杨振涛 余希猛 段强 ZHANG Jinli;YANG Zhentao;YU Ximeng;DUAN Qiang(No.13 Research Institute of China Electronics Technology Group Corporation,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《电子质量》2023年第8期107-111,共5页Electronics Quality

摘　　要：以基于高温共烧陶瓷(HTCC)技术制作带电镀线的陶瓷外壳为研究对象,对电镀线对共寄生参数的影响进行了分析。首先通过仿真软件分析了电镀线长度、宽度和电镀线的位置对信号线电容、电感的影响情况,仿真结果表明信号线电容值随电镀线长度的增加而线性增加;电镀线宽度增加一倍,电容值增加0.84%,电镀线宽度对信号线电容几乎无影响;电镀线位置距地平面的距离增加一倍,电容值减小4.66%。信号线电感值随电镀线长度的增加而减小,随电镀线宽度的增加而减小,随电镀线位置距地平面的距离的增加而减小。然后,加工并制备试验样品进行电容、电感测试,测试结果与仿真结果具有很好的一致性。通过研究,掌握了电镀线对陶瓷外壳信号线寄生参数的影响程度,可较快设计同类陶瓷外壳,满足不同用户的需求。By taking the ceramic shell with electroplating line made by HTCC technology as the research object,the influence of electroplating on its parastic parameters is analyzed.Firstly,the influence of length,width and position of electroplating line on capacitance and inductance of signal line is analyzed by simulation software.The simulation results show that the capacitance of the signal line increases linearly with the increase of the length of the electroplating line.The capacitance value is increased by 0.84%when the width of electroplating line is doubled,so the width of electroplating line has little effect on the capacitance of signal line.When the distance between the electroplating line position and the ground plane is doubled,the capacitance value decreases by 4.66%.The inductance value of the signal line decreases with the increase of the length of the electroplating line,decreases with the increase of the width of the electroplating line,and decreases with the increase of the distance between the electroplating line and ground plane.Then,the test samples are processed and prepared to test the capacitance and inductance,and the test results are in good agreement with the simulation results.Through the research,the influence degree of electroplating wire on the parastic parameters of ceramic shell signal wire is mastered,and the similar ceramic shell can be designed quickly to meet the needs of different users.

关 键 词：电镀线 陶瓷封装外壳 信号线 寄生参数 

分 类 号：TN305[电子电信—物理电子学]