晶圆级封装翘曲研究及仿真自动化  

Research and simulation automation of wafer warpage in Wafer Level Packaging

作　　者：白红圆 张振越 季钰麟 王波 王剑峰 BAI Hong-yuan;ZHANG Zhen-yue;JI Yu-lin;WANG Bo;WANG Jian-feng(Wuxi Zhongwei High-etch Electronics Co.,Ltd)

机构地区：[1]无锡中微高科电子有限公司

出　　处：《中国集成电路》2023年第8期70-75,89,共7页China lntegrated Circuit

基　　金：国家科技部重点研发计划(2020YFB1807303)。

摘　　要：晶圆的翘曲一直是晶圆级封装工艺面临的重要挑战。本文针对晶圆的非线性翘曲现象,分别对多种有限元仿真方法进行比较,并提出了一种基于非对称网格的非线性仿真方法;结果表明,采用非对称网格的方法能够得到与测试结果一致的拱型翘曲,同时仿真与实测误差为2.22%,低于其他仿真方法。利用该方法深入研究了晶圆降温过程翘曲变形的过程,并对模型中EMC厚度进行了参数化分析,揭示了晶圆翘曲随EMC厚度变化的影响趋势。最后本文对美国ANSYS公司的有限元分析软件(ANSYS)进行二次开发,使得软件能够自动、快速、准确地获得晶圆的翘曲结果。The warpage of the wafer has always been an important challenge facing the wafer level packaging process.In this paper,a variety of finite element simulation methods are compared for the nonlinear warpage of the wafer,respectively,and propose a nonlinear simulation method based on asymmetric grid.The results show that the method of asymmetric grid can be obtained.The resulting arched warpage,and simulation and measurement error were 2.22%lower than other simulation methods.Using this method,the process of warpage deformation of wafer cooling process was studied.The parametric analysis of mold thickness is carried out,and the influence trend of wafer warpage with mold thickness is revealed.Finally,the secondary development of ANSYS is carried out in this paper.The software can automatically,quickly and accurately obtain the wafer warpage.

关 键 词：晶圆级封装 翘曲 板壳理论 二次开发 非线性 

分 类 号：TN305.94[电子电信—物理电子学]