面向集成电路产业的电子电镀研究方法  

Instrumental methodologies of electronic electroplating towards the integrated circuit industry

作　　者：金磊 杨家强 赵弈 王赵云 陈思余 郑安妮 宋韬 杨防祖[1] 詹东平[1] Lei Jin;Jia-Qiang Yang;Yi Zhao;Zhao-Yun Wang;Si-Yu Chen;An-Ni Zheng;Tao Song;Fang-Zu Yang;Dongping Zhan(National Engineering Research Center of Chemicals for Electronics Manufacturing(Reconstruction),State Key Laboratory of Physical Chemistry of Solid Surfaces,Tan Kah Kee Innovation Laboratory,Engineering Research Center of Electrochemical Technologies of Ministry of Education,College of Chemistry and Chemical Engineering,Xiamen University,Xiamen 361005,China)

机构地区：[1]高端电子化学品国家工程研究中心(重组),固体表面物理化学国家重点实验室,福建能源材料科学与技术创新实验室,电化学技术教育部工程研究中心,厦门大学化学化工学院,厦门361005

出　　处：《中国科学：化学》2023年第10期1822-1834,共13页SCIENTIA SINICA Chimica

基　　金：国家自然科学基金(编号:22132003、21972118、22021001)资助项目。

摘　　要：电子电镀是集成电路等高端电子制造产业的核心技术之一,其技术特点和难点在于在微纳米尺度通孔、盲孔、沟槽等限域空间内部实现金属镀层的均匀增厚或致密填充.然而,我国针对面向集成电路制造产业的微纳尺度电子电镀过程中的金属电沉积的表界面反应过程、添加剂的分子作用机制及其协同作用、以及镀层的理化结构与电学性能之间的构效关系的基础研究十分薄弱,缺乏系统和成熟的理论体系和研究方法.结合厦门大学电镀学科多年的科研工作,本文拟归纳微纳米尺度电子电镀的关键科学问题和技术难点,介绍电子电镀镀液体系的发展,梳理电子电镀的经典电化学研究方法和电化学原位先进研究方法,展望电子电镀工况研究方法的必要性和紧迫性,希望助力发展先进的电子电镀研究方法,推动电子电镀基础理论和工艺技术研究的进步.Electronic electroplating is one of the core technologies in advanced electronic manufacturing,especially the ultra large scale integrated circuits(ULSI).The technical challenge is to realize the uniform thickening and the void-free filling of either through holes or blind holes with the high-aspect ratio and micro/nano-meter scaled size.However,the surface and interfacial reaction kinetics of metal electrodeposition processes,the molecular mechanism and synergetic effects of electroplating additives,and the structure–performance correlation of electroplating layers,are lack of investigations.Challenges still remain in both fundamentals and methodologies.Based on the longstanding and unremitting research work of the electroplating group at Xiamen University,this review would like to propose the key scientific problems and technical difficulties of the electronic electroplating at the micro-/nano-meter scale,introduce the development of the electrolyte system,sort through the classic and advanced instrumental methods for electronic electroplating,discuss the urgent necessities of the operando techniques,in order to stimulate the developments of the advanced instrumental methodologies,and promote the progress of both fundamental researches and engineering technologies of the electronic electroplating.

关 键 词：研究方法 电子电镀 集成电路 金属互连 

分 类 号：TQ153[化学工程—电化学工业] TN405[电子电信—微电子学与固体电子学]