金属铜电沉积调控及其在芯片制造中的应用  

Regulation of copper electrodeposition and its application in chip manufacturing

作　　者：廖小茹 李真 谭柏照 罗继业 史训清 Xiaoru Liao;Zhen Li;Baizhao Tan;Jiye Luo;Daniel Shi(School of Chemical Engineering and Light Industry,Guangdong University of Technology,Guangzhou,510006,China;Hong Kong Applied Science and Technology Research Institute(ASTRI),Hong Kong 999077,China)

机构地区：[1]广东工业大学轻工化工学院,广州510006 [2]香港应用科技研究院有限公司,中国香港999077

出　　处：《中国科学：化学》2023年第10期1989-2007,共19页SCIENTIA SINICA Chimica

基　　金：国家自然科学基金(编号:22178071)资助项目。

摘　　要：金属铜因其优异的导电性、导热性、机械延展性和抗电迁移性,在芯片制造工业中作为互连材料广泛应用.铜互连结构的制备主要使用湿法的电化学沉积技术.本文针对芯片制造相关金属铜电沉积工艺,系统介绍了金属铜电沉积调控用关键添加剂组分及其作用原理,并详细介绍了电镀铜在芯片制造核心工艺(大马士革电镀、硅通孔、铜柱电镀及再布线层电镀)中的技术需求、工艺流程及未来技术发展趋势.最后,本文针对我国高端电子电镀行业的发展现状,对金属铜电沉积调控及其在芯片制造中的应用未来发展方向进行了展望.Copper is extensively utilized as an interconnect material in the chip manufacturing industry due to its excellent electrical conductivity,thermal conductivity,mechanical ductility,and resistance to electromigration.The manufacturing of copper interconnects mainly relies on the wet electrochemical deposition technique.This review focuses on the copper electroplating process employed in chip manufacturing and systematically introduces the key additive components and their mechanisms for controlling copper electrodeposition.Additionally,the paper provides comprehensive overview of the electroplating requirements,manufacturing process flow,and future technological trends concerning electroplated copper in core chip manufacturing processes such as Damascene electroplating,through silicon via electroplating,copper pillar bumps electroplating,and redistribution layer electroplating.Finally,this review presents an outlook based on the current state of China’s high-end electronic electroplating industry and discusses the future development direction of copper electroplating and its application in chip manufacturing industry.

关 键 词：电子电镀 铜沉积 电镀添加剂 芯片制造 超等角电镀 

分 类 号：TQ153.14[化学工程—电化学工业] TN405[电子电信—微电子学与固体电子学]