碳化硅功率模块封装及热管理关键技术  

A state-of-art review on SiC power module packaging and thermal management key technologies

作　　者：盛况[1] 唐苇羽 吴赞 SHENG Kuang;TANG Weiyu;WU Zan(College of Electrical Engineering,Zhejiang University,Hangzhou,Zhejiang 310027,China)

机构地区：[1]浙江大学电气工程学院,浙江杭州310027

出　　处：《机车电传动》2023年第5期1-9,共9页Electric Drive for Locomotives

基　　金：国家重点研发计划项目(2022YFB3604103)。

摘　　要：碳化硅功率器件具有耐高压、开关速度快和导通损耗低等优点,因此正在逐渐成为电力变换系统的核心器件,尤其在新能源汽车、可再生能源、储能、数据中心、轨道交通和智能电网等领域,器件的应用越来越广泛。然而,碳化硅器件持续的小型化和快速增长的功率密度也给功率模块封装与热管理带来了新的挑战。传统封装结构和散热装置热阻较大,难以满足碳化硅器件高热流密度冷却需求,同时,高功率密度模块散热集成封装需求也日益增长。针对上述挑战,文章对国内外现有的典型功率模块封装结构进行了详细介绍和分类对比;枚举比较了不同功率模块散热方式及其技术特点,如热扩散装置、对流换热和相变散热等;最后,结合以往的碳化硅功率模块热封装研究,对下一代碳化硅模块封装与热管理技术面临的挑战和未来的发展趋势进行了展望。Silicon carbide(SiC)power devices have advantages such as high withstanding voltage,fast switching speed,and low conduction losses.Therefore,they are gradually becoming core components of power conversion systems,especially in areas such as new energy vehicles,renewable energy,energy storage,data centers,rail transit,and smart grids.Power devices applications are becom‐ing increasingly wide-ranging.However,the continuous miniaturization and rapid increase in power density of SiC devices pose new challenges for power module packaging and thermal management.Traditional packaging structures and heat dissipation devices provide high thermal resistance,making it difficult to meet the high heat flux cooling requirements of SiC devices.Additionally,there is a grow‐ing demand for integrated heat dissipation packaging in high power density module.In response to the above challenges,this paper pro‐vided a detailed introduction and comparative analysis of typical power module packaging structures from both domestic and international sources.Different power module heat dissipation methods including their technical characteristics were enumerated and compared,such as heat spreaders,convective heat transfer,and phase change heat dissipation.Finally,based on previous researches on thermal packag‐ing of SiC power modules,the challenges and future development trends in the next generation of SiC module packaging and thermal management technologies were discussed.

关 键 词：碳化硅 功率模块 封装 热管理技术 

分 类 号：TN304.24[电子电信—物理电子学]