基于三元等离子体处理的PCB高厚径比孔清洗技术研究  

Research on ternary plasma cleaning technology for PCB through-hole of high-aspect ratio

作　　者：贾维 唐瑞芳 刘胜贤 周国云 洪延 陈磊 李志强 JIA Wei;TANG Ruifang;LIU Shengxian;ZHOU Guoyun;HONG Yan;CHEN Lei;LI Zhiqiang(School of Materials and Energy,University of Electronic Science and Technology of China,Chengdu 610054,Sichuan,China;Putian Hanjiang Yidun Multi-layer Circuit Co.,Ltd.,Putian 351117,Fujian,China;Zhuhai Hengertech Co.,Ltd.,Zhuhai 519070,Guangdong,China)

机构地区：[1]电子科技大学材料与能源学院,四川成都610054 [2]莆田市涵江区依吨多层电路有限公司,福建莆田351117 [3]珠海恒格微电子装备有限公司,广东珠海519070

出　　处：《印制电路信息》2023年第10期31-35,共5页Printed Circuit Information

摘　　要：三元等离子体在处理高厚径比通孔、活化高频印制电路板(PCB)方面存在突出的性能优势。以等离子体清洗量和清洗均匀性为评价指标,针对三元等离子体(O_(2)/N_(2)/CF_(4))在高厚径比通孔清洗中的关键性参数及其最优化应用范围进行研究。金相显微镜与扫描电子显微镜(SEM)观察显示,三元等离子体在清洗高厚径比通孔时设置在温度75~105℃、功率7.0~8.5 kW、CF_(4)含量8%~10%时,能够得到良好的清洗效果。Ternary plasma has outstanding performance advantages in processing through-hole of high aspect ratio and activating high-frequency printed circuit boards.This article takes the plasma cleaning amount and uniformity as evaluation indicators,and studies the key parameters and optimal application range of ternary plasma(O_(2)/N_(2)/CF_(4))in the cleaning of high aspect ratio through-holes.The results indicate that the temperature should be set at 75‒105℃,the power should be 7.0‒8.5 kW,and the CF_(4) content should be 8%‒10%.The observation of metallographic microscope and SEM shows that this condition can achieve good cleaning effect.

关 键 词：高厚径比 通孔 三元等离子体 印制电路板 

分 类 号：TN41[电子电信—微电子学与固体电子学]