双激光刻蚀与清洗挠性覆铜板工艺及质量研究  

Study on Process and Quality of Dual Laser Etching and CleaningFlexible Copper Clad Laminate

作　　者：黄支慧 叶其科 叶其教 廖健宏[1] Huang Zhihui;Ye Qike;Ye Qijiao;Liao Jianhong(School of Information and Optoelectronic Science and Engineering,South China Normal University,Guangzhou 510006,Guangdong,China;Lijieke Laser Technology Co.,Ltd.,Guangzhou 511450,Guangdong,China)

机构地区：[1]华南师范大学信息光电子科技学院,广东广州510006 [2]力捷科激光科技股份有限公司,广东广州511450

出　　处：《激光与光电子学进展》2023年第17期256-263,共8页Laser & Optoelectronics Progress

摘　　要：针对当前纳秒激光刻蚀覆铜板盲孔普遍存在的孔底残胶(堵孔)、过蚀、侧壁损伤和后续处理工序繁琐等问题,提出了双激光同步刻蚀与清洗的技术,采用纳秒激光和纳秒匹配皮秒激光对覆铜板进行了一阶盲孔对比刻蚀试验。由试验结果得知,采用纳秒匹配皮秒激光在厚度为49.00μm的覆铜板上刻蚀出了直径为122.24μm、深度为(37.02±0.04)μm(加工要求37.00μm)、孔底粗糙度为0.16μm、表面粗糙度为0.25μm且侧壁无缩胶的盲孔。研究结果表明,双激光刻蚀与清洗覆铜板的工艺大幅度提高了加工精度和质量,获得了高品质盲孔,其中纳秒匹配皮秒激光在刻蚀深度(精准性)、洁净度、锥度和粗糙度方面均优于纳秒激光。We propose a dual laser simultaneous etching and cleaning technique to solve the issues of residual glue(blockage),over-etching,sidewall damage,and tedious subsequent processing of blind holes in copper clad laminates by nanosecond laser etching.First-order blind hole etching experiments were conducted on copper clad laminates using nanosecond and nanosecond-matched picosecond lasers.Furthermore,a blind hole with a 122.24μm diameter,a(37.02±0.04)μm depth(37.00μm processing requirement),a 0.16μm bottom roughness,and a 0.25μm surface roughness on the side walls was etched without shrinkage on a 49.00μm-thick copper clad plate using the nanosecondmatched picosecond laser.The results indicate a significant improvement in the processing accuracy and quality of the dual laser etching and cleaning process for the copper clad plates,thereby obtaining high-quality blind holes.In conclusion,the nanosecond-matched picosecond laser shows superior etching depth(accuracy),cleanliness,taper,and roughness compared to the nanosecond laser.

关 键 词：激光技术 双激光刻蚀 挠性覆铜板 清洗 盲孔 

分 类 号：TN249[电子电信—物理电子学]