先进封装RDL-first工艺研究进展  

Research Progress of RDL-First Process in Advanced Packaging

作　　者：张政楷 戴飞虎 王成迁 ZHANG Zhengkai;DAI Feihu;WANG Chengqian(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子与封装》2023年第10期26-35,共10页Electronics & Packaging

摘　　要：随着摩尔定律逐步达到极限,大量行业巨头暂停了7 nm以下工艺的研发,转而将目光投向先进封装领域。其中再布线先行(RDL-first)工艺作为先进封装技术的重要组成部分,因其具备高良率、高密度布线的优势吸引了大量研究者的目光。总结了RDL-first工艺的技术路线及优势,详细介绍其工艺进展,模拟其在程序中的应用,并对RDL-first工艺的发展方向进行展望,为RDL-first技术的进一步优化提供参考。As Moore's Law gradually reaches its limits,a large number of industry giants have suspended the development of sub-7 nm processes and turned their attention to advanced packaging instead.The redistribution layer first(RDL-first)process,as an important part of advanced packaging technology,has attracted the attention of a large number of researchers due to its advantages of high yield and high density wiring.The technical route and advantages of the RDL-first process are summarized,the progresses of its process are described in detail,and its applications in procedures are simulated.An outlook on the development direction of the RDL-first process and a reference for further optimization of the RDL-first technology are provided.

关 键 词：先进封装 再布线先行(RDL-first) 高密度布线 

分 类 号：TN305.94[电子电信—物理电子学]