基于陶瓷衬底的薄膜再布线工艺及组装可靠性研究  

Thin Film Rerouting Process and Assembly Reliability Study Based on Ceramic Substrate

作　　者：朱喆 黄陈欢 李林森[1] 刘俊夫[1,2] ZHU Zhe;HUANG Chenhuan;LI Linsen;LIU Junfu(Anhui Province Key Laboratory of Micro-System,China Electronics Technology Group Corporation No.43 Research Institute,Hefei 230088,China;China Electronics Technology Group Corporation No.43Research Institute,Hefei 230088,China)

机构地区：[1]中国电子科技集团公司第四十三研究所微系统安徽省重点实验室,合肥230088 [2]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《电子与封装》2023年第10期52-57,共6页Electronics & Packaging

摘　　要：随着军用武器装备向着智能化、小型化方向发展,业界对集成封装技术提出了更高的要求。基于陶瓷衬底的高密度薄膜再布线技术可应用于薄膜陶瓷多芯片组件(MCM-C/D)封装结构,实现感知系统、计算系统、测试系统等的小型化集成。制备了基于高温共烧陶瓷衬底的两层金属两层介质(HTCC-2M2P)结构的高密度载板样品,布线密度≤40μm/40μm,经过高温存储、温度循环等环境考核后,再布线层的可组装性满足GJB548标准对于焊接和引线键合的技术要求。With the development of military equipment in the direction of intelligence and miniaturization,higher requirements have been put forward for integrated packaging technology.High density thin film rerouting technology based on ceramic substrates can be applied to thin-film multi-chip module-ceramic/deposition(MCM-C/D)package structures to realize miniaturized integration of sensing systems,computing systems,and testing systems.High density carrier board samples based on high-temperature co-fired ceramics with two-layer metal two-layer dielectric(HTCC-2M2P)structure with wiring density≤40μm/40μm are prepared,and the assemblability of the rerouting layer meets the technical requirements for soldering and lead bonding in accordance with the GJB548 standard after the environmental assessment such as high temperature storage and temperature cycling.

关 键 词：薄膜工艺 再布线层 可组装性 

分 类 号：TN305.94[电子电信—物理电子学]