红外探测器制备中不同镀金层的对比分析  

Comparative analysis of the difference gold plating layers in IRFPA

作　　者：刘森[1] 张磊[1] 杨斌 李忠贺[1] LIU Sen;ZHANG Lei;YANG Bin;LI Zhong-he(North China Research Institute of Electro Optics,Beijing 100015,China)

机构地区：[1]华北光电技术研究所,北京100015

出　　处：《激光与红外》2023年第10期1552-1554,共3页Laser & Infrared

摘　　要：针对红外探测器制备过程中的多种镀金工艺展开了研究,通过对不同工艺制备的镀金层进行扫描电镜观察,发现不同的镀金工艺制备的样品存在较大的差异。电镀金层的晶粒直径为2~3μm,真空蒸发镀金的晶粒直径为100~600nm,离子束溅射镀金的晶粒直径在30~70nm之间。对不同的方法制备的金层与铟焊料的扩散速度进行了试验及分析,发现晶粒尺寸越小铟的扩散速度越快。In this paper,various gold plating in IRFPA are studied.The surface of the gilding is observed by scanning electron microscope and it is obtained that there are large differences in the samples prepared by different plating processes.The results shows that the size of the crystalline grain is 2~3μmby electroplating,the size of the crystalline grain is 100~600 nm by vacuum evaporation,and the size of the crystalline grain is between 30 nm to 70 nm by IBS.The diffusion rates of gold layers prepared by different methods with indium solder are tested and analyzed and it is found that smaller the crystalline grain size the faster the diffusion rate of indium.

关 键 词：IRFPA电镀 真空蒸发 离子束溅射 晶粒 

分 类 号：TN214[电子电信—物理电子学] TN29