高密度系统级封装技术及可靠性研究进展  

Research progress on high-density system-in-package technology and reliability

作　　者：于沐瀛 杨东升 冯佳运 黄亦龙 王一平 王帅 田艳红[1] YU Muying;YANG Dongsheng;FENG Jiayun;HUANG Yilong;WANG Yiping;WANG Shuai;TIAN Yanhong(School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China;Guobo Electronics Co.,Ltd.,Nanjing 210016,China)

机构地区：[1]哈尔滨工业大学材料学院,黑龙江哈尔滨150001 [2]南京国博电子股份有限公司,江苏南京210016

出　　处：《微电子学与计算机》2023年第11期149-156,共8页Microelectronics & Computer

基　　金：国家自然科学基金项目(U2241223)。

摘　　要：随着无线通信等技术在民用领域的拓展推广,电子元器件性能得到大幅提升.同时,伴随着电子系统集成度的提高,器件也向着小型化、轻量化、精密化、多功能化的方向发展.由于器件的服役环境随着其设计功能的拓展变得更为苛刻,探究器件先进封装结构、材料的设计及服役可靠性对其实现预期功能的效果是尤为关键的.列举了无线通信系统中常用的封装技术及其相关的发展历程,阐述了高密度封装的特点、潜在的可靠性问题,并简要介绍了现有的解决方案.With the expansion of wireless communication and other technologies in the civilian field,the performance of electronic components has been greatly improved,and at the same time,along with the improvement of the integration of electronic systems,the devices are also developed in the direction of miniaturisation,lightweight,precision and multifunctionality.And the service environment of the device becomes more demanding with the expansion of its design function,so it is especially critical to explore the effect of advanced packaging structure,material design and service reliability of the device to achieve the desired function.This paper lists the commonly used packaging technologies in wireless communication systems and their related development history,describes the characteristics of high-density packaging,potential reliability problems and briefly introduces the existing solutions.

关 键 词：系统级封装 高密度封装 可靠性 片上系统 

分 类 号：TN405[电子电信—微电子学与固体电子学]