金丝楔形键合强度的影响规律分析  

Analysis of Influence Law of Gold Wire Wedge Bonding Strength

作　　者：高依然 刘森[1] 魏威 王冠[1] 方志浩 韩健睿 刘亚泽 GAO Yi-ran;LIU Sen;WEI Wei;WANG Guan;FANG Zhi-hao;HAN Jian-rui;LIU Ya-ze(North China Research Institute of Electro-Optics,Beijing 100015,China)

机构地区：[1]华北光电技术研究所,北京100015

出　　处：《红外》2023年第11期13-22,共10页Infrared

摘　　要：金丝楔形键合是一种通过超声振动和键合力协同作用来实现芯片与电路引出互连的技术。现今,此引线键合技术是微电子封装领域最重要、应用最广泛的技术之一。引线键合互连的质量是影响红外探测器组件可靠性和可信性的重要因素。基于红外探测器组件,对金丝楔形键合强度的多维影响因素进行探究。从键合焊盘质量和金丝楔焊焊点形貌对键合强度的影响入手,开展了超声功率、键合压力及键合时间对金丝楔形键合强度的影响研究。根据金丝楔焊原理及工艺过程,选取红外探测器组件进行强度影响规律试验及分析,指导实际金丝楔焊工艺,并对最佳工艺参数下的金丝键合拉力均匀性进行探究,验证了金丝楔形键合强度工艺一致性。Wire wedge bonding is a kind of technology which realizes the connecting of chip and circuit through the synergistic action of ultrasonic vibration and bonding force.Today,this lead bonding technology is one of the most important and widely used technologies in the field of microelectronics packaging.The quality of wire bonding interconnect is an important factor affecting the reliability and trustworthiness of infrared de-tector components.In this paper,based on infrared detector module,the multi-dimensional influencing factors of gold wire wedge bonding strength are explored.Starting with the influence of bonding pad quality and the shape of gold wire wedge welding spot on bonding strength,the influence of ultrasonic power,bonding pres-sure and bonding time on the gold wire wedge bonding strength is studied.Acording to the principle and process of gold wire wedge welding,the infrared detector component is selected to conduct the strength influ-ence test and analysis,which can guide the actual gold wire wedge welding process.And the uniformity of gold wire bond tensile force under the best process parameters is explored,which verifies the consistency of gold wire wedge bond strength process.

关 键 词：引线键合 楔形键合 超声键合 影响规律分析 

分 类 号：TN405[电子电信—微电子学与固体电子学]