金属纳米材料低温键合及图形化制备研究进展  

Research progress in low temperature bonding and patterning of metal nanomaterials

作　　者：杜荣葆 邹贵生[1,2] 王帅奇 刘磊[1,2] DU Rongbao;ZOU Guisheng;WANG Shuaiqi;LIU Lei(State Key Laboratory of Clean and Efficient Turbomachinery Power Equipment,Department of Mechanical Engineering,Tsinghua University,Beijing,100084,China;Key Laboratory for Advanced Materials Processing Technology,Ministry of Education,Beijing,100084,China)

机构地区：[1]清洁高效透平动力装备全国重点实验室,清华大学机械工程系,北京100084 [2]先进成形制造教育部重点实验室,北京100084

出　　处：《焊接学报》2023年第12期82-96,I0008,I0009,共17页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(52075287,52275346)。

摘　　要：利用金属纳米材料的尺寸效应可显著降低连接温度,提高焊点可靠性,以银纳米焊膏为代表的金属纳米低温连接材料在第三代半导体为代表的功率芯片封装中充分验证并量产.面向集成电路的先进封装需要图形化焊点,将功率芯片封装技术转移到先进封装中,需要同时满足低温键合和图形化键合的要求,极大地增加了技术难度.文中首先剖析了金属纳米材料降低键合温度的基本科学原理,并进一步综述了不同纳米材料低温键合的研究现状,重点总结了可键合纳米材料的图形化方法,为先进封装中细节距、高精度、高效率的图形化低温键合提供技术参考.Utilizing the size effect of metal nanomaterials can significantly lower the bonding temperature and enhance the reliability of solder joints.Low temperature bonding metal nanomaterials,such as silver nano solder paste,have undergone extensive validation and mass production in the packaging of power devices,represented by third-generation semiconductors chips.However,when it comes to advanced packaging for integrated circuits that require patterned solder joints,the challenge lies in transferring power chip packaging technology to meet both low-temperature bonding and patterning bonding requirements,significantly increasing the technical complexity.This article begins by dissecting the fundamental scientific principles behind reducing bonding temperature through the utilization of metal nanomaterials.It then provides an extensive review of the current research status in low-temperature bonding with various nanomaterials.Finally,it focuses on summarizing patterning methods for bondable nanomaterials,offering technical insights for achieving precise spacing,high precision,and efficient graphical low-temperature bonding in advanced packaging.

关 键 词：先进封装 金属纳米材料 低温键合 图形化 

分 类 号：TG425[金属学及工艺—焊接] TN405[电子电信—微电子学与固体电子学]