氢化松香酸值、软化点对SnAg3.0Cu0.5焊锡膏基本性能的影响  

Effect of Hydrogenated Rosin Acid Value, Softening Pointon Basic Performance of SnAg3.0Cu0.5 Solder Paste

作　　者：王艳南 何欢 武信 柳丽敏 熊晓娇 WANG Yan-nan;HE Huan;WU Xin;LIU Li-min;XIONG Xiao-jiao(Yunnan Tin Industry Tin Material Co.,Ltd.,Kunming,Yunnan 650501,China)

机构地区：[1]云南锡业锡材有限公司,云南昆明650501

出　　处：《云南冶金》2023年第6期115-121,共7页Yunnan Metallurgy

摘　　要：选用高酸值KE-604、中酸值AXE、无酸值KE-100三种氢化松香制备焊锡膏并进行基本性能测试。研究表明氢化松香的软化点越低Ti值越高、抗塌落性能越好,焊接过程中产生锡珠越少;高酸值松香能提高焊锡膏的焊接性,减少铜板腐蚀;中酸值全氢化松香能增加焊锡膏的抗塌落性能、润湿性和降低空洞率;无酸值松香酯能增强焊锡膏成膜性和提高抗塌落性能;在助焊剂配方中通常使用两种或两种以上的复配松香代替单一松香,来获得更好的焊锡膏性能。Three kinds of hydrogenated rosin that KE-604 with high acid value,AXE with medium acid value,and KE-100 with non-acid value were selected to prepare the solder paste and did the basic performance tests.The study shows,the lower the softening point of hydrogenated rosin,the higher the Ti value,the better the anti-collapse performance,and the less solder ball can be generated in the welding process;high acid value rosin can increase the weldability of solder paste,decrease the copper plate corrosion;the whole hydrogenated rosin with medium acid value can increase the anti-collapse performance,wettability of solder paste,and decrease the void rate;non-acid value rosin ester can increase the film-forming of solder paste and the anti-collapse performance;in the flux formula,it often used two or more compound rosin to instead single rosin,to get the better performance of solder paste.

关 键 词：松香 软化点 酸值 润湿 锡珠 空洞率 

分 类 号：TG425[金属学及工艺—焊接]