环氧树脂及酚醛树脂黏度对环氧塑封料性能的影响  

Effect of Viscosity of Epoxy Resin and Phenolic Resin on Properties of Epoxy Molding Compounds

作　　者：曹二平 CAO Erping(Hysol Huawei Electronics Co.,Ltd.,Shanghai Hengsuo Electronics Branch,Shanghai 200120,China)

机构地区：[1]衡所华威电子有限公司上海衡锁电子分公司,上海200120

出　　处：《电子与封装》2024年第1期6-10,共5页Electronics & Packaging

摘　　要：以联苯多芳香型环氧树脂为基体、联苯多芳香型酚醛树脂为固化剂,制备了5种环氧塑封料。通过电热盘、毛细管流变仪、邵氏热硬度仪、动态热机械分析仪、万能拉伸试验机和超声波扫描仪等对环氧塑封料进行表征。结果表明,当环氧树脂的黏度从1.2 Pa·s提高到3.7 Pa·s、酚醛树脂的黏度从0.8 Pa·s提高到1.5 Pa·s时,环氧塑封料的凝胶化时间从31 s下降到22 s;螺旋流动长度从137.16 cm下降到88.90 cm,降低了35.2%;环氧塑封料的黏度从19.6 Pa·s提高到35.8 Pa·s,提高了82.7%;内部气孔从20个减少到4个。这些变化说明环氧塑封料的黏结性降低、模量提高。环氧树脂黏度对环氧塑封料性能的影响大于酚醛树脂黏度。Five types of epoxy molding compounds are prepared using biphenyl polyaromatic epoxy resin as matrix and biphenyl polyaromatic phenolic resin as curing agent.The epoxy molding compounds are characterized by electric heating plate,capillary rheometer,Shore thermal hardness tester,dynamic thermomechanical analyzer,universal tensile testing machine and ultrasonic scanner.The results show that when the viscosity of epoxy resin is increased from 1.2 Pa·s to 3.7 Pa·s and the viscosity of phenolic resin is increased from 0.8 Pa·s to 1.5 Pa·s,the gelation time of epoxy molding compounds is decreased from 31 s to 22 s;the helical flow length is decreased from 137.16 cm to 88.90 cm,which is a reduction of 35.2%;the viscosity of the epoxy molding compounds is increased from 19.6 Pa·s to 35.8 Pa·s,which is an increase of 82.7%;the number of the internal pores is reduced from 20 to 4.These changes indicate a decrease in adhesion and an increase in modulus of epoxy molding compounds.The effect of viscosity of epoxy resin on the properties of epoxy molding compounds is greater than that of viscosity of phenolic resin.

关 键 词：环氧树脂 酚醛树脂 黏度 环氧塑封料 

分 类 号：TN305.94[电子电信—物理电子学] TQ323.5[化学工程—合成树脂塑料工业]