高导热底填胶对星载端机BGA器件可靠性影响评估  

Evaluation of the effect of high thermal conductivity underfill on the reliability of BGA device in satellite-borne terminal equipment

作　　者：张晟[1] 张晨晖[1] 许培伦 刘志丹 金星 Zhang Sheng;Zhang Chenhui;Xu Peilun;Liu Zhidan;Jin Xing(China Electronics Technology Group Corporation No.20th Research Institute,Xi′an 710068,Shaanxi,China)

机构地区：[1]中国电子科技集团公司第二十研究所,陕西西安710068

出　　处：《中国胶粘剂》2023年第12期46-51,共6页China Adhesives

摘　　要：针对星载产品对高导热绝缘底填胶可靠性应用需求,开展双组分高导热绝缘胶对BGA焊点可靠性及环境适应性影响评估。采用导热绝缘胶填充工艺,设计制作星载端机典型BGA菊花链网络结构试验件及端机模拟件,并开展菊花链试验件一系列鉴定级环境与可靠性试验。研究结果表明:采用BGA菊花链器件和印制板设计制作的菊花链网络结构试验件,通过高导热绝缘底填胶填充,实现导热底填胶对BGA焊点可靠性的影响评价,设计方案合理;全过程菊花链电路电阻均无增大、中断现象,无焊点失效、断裂现象,导热绝缘胶填充过程中对菊花链试验件没有引进的缺陷,高导热底填胶对BGA焊点没有影响;模拟件经过星载产品验收级环境与可靠性试验,试验前后电性能指标及监测过程无明显差异,符合指标设计要求;导热绝缘胶填充过程中对模拟件没有引进的缺陷,表明模拟件具有经受环境应力和工作应力的能力;高导热绝缘底填胶对模拟件电性能指标没有异常影响,满足星载产品散热及抗高载荷的需求,实现可靠性应用。In response to the reliability application requirements of high thermal conductivity insulation underfill for satellite-borne products,the impact of two-component high thermal insulation adhesive on the reliability and environmental adaptability of BGA solder spots was evaluated.By using the thermal insulation adhesive filling process,the typical BGA daisy-chain network structure test pieces and satellite-borne terminal simulation parts were designed and manufactured,and a series of certified-level environmental and reliability tests for daisy-chain test pieces were carried out.The research results showed that the daisy-chain network structure test piece designed and manufactured by using BGA daisy-chain devices and printed circuit boards,was filled with high thermal conductivity insulation underfill,the impact evaluation of thermal conductivity underfill on the reliability of BGA solder spots was achieved,which proved the design was reasonable.The resistance of the daisychain circuit did not increase or interrupted throughout the entire process,there was no failure and fracture phenomenon of solder spots,there was no introduced defects to the daisy-chain test pieces in the process of filling the thermal insulation adhesive,demonstrating that the high thermal conductivity underfill had no effect on BGA solder spots.The simulation parts passed the acceptance-level environmental and reliability tests of satellite-borne products,and there were no significant differences in the electrical performance indexes and monitoring process before and after the test,which met the requirements of the design indicators.There were no introduced defects in the process of filling the thermal insulation adhesive,which indicated that the simulation parts had the ability to withstand the environmental stress and working stress.The high thermal conductivity insulation underfill had no abnormal influence on the electrical performance indexes of the simulation parts,which met the requirements of heat dissipation and high load resistance

关 键 词：高导热底填胶 BGA器件 菊花链 模拟件 焊点 环境试验 可靠性 

分 类 号：TQ430[化学工程]