模塑型环氧底填料的研究与应用进展  

Progress on the research and application of molded epoxy underfill

作　　者：戴晟伟 张有生 杨昶旭 王晓蕾 齐悦新 韩淑军 职欣心 刘金刚[1] Dai Shengwei;Zhang Yousheng;Yang Changxu;Wang Xiaolei;Qi Yuexin;Han Shujun;Zhi Xinxin;Liu Jingang(Engineering Research Center of Ministry of Education for Geological Carbon Storage and Low Carbon Utilization of Resources,School of Materials Science and Technology,China University of Geosciences,Beijing 100083,China;Zhejiang Jameen New Material Co.,Ltd.,Jiaxing 314011,Zhejiang,China)

机构地区：[1]地质碳储与资源低碳利用教育部工程研究中心,中国地质大学(北京)材料科学与工程学院,北京100083 [2]浙江嘉民新材料有限公司,浙江嘉兴314011

出　　处：《中国胶粘剂》2023年第12期52-60,共9页China Adhesives

基　　金：深圳市科技计划项目(技术攻关重点项目)(JSGG20210629144539012)。

摘　　要：底填料是倒装芯片(FC)型先进电子封装的关键材料之一,而模塑型底填料(MUF)是近年来发展起来的一类重要的底填料品种。本文综述了国内外近年来在MUF材料基础与应用领域中的研究与应用进展情况,从先进FC封装技术的发展对MUF材料的性能需求、MUF材料组成结构设计以及当前FC封装应用中的主流MUF材料的研究与应用现状等几个方面进行了阐述。最后对先进FC封装技术用MUF材料的未来发展趋势进行了展望。Underfill is one of the key materials for advanced electronic packaging of flip chip(FC)type,while molded underfill(MUF)is an important type of underfill in recent years.In this paper,the progress on the research and application in the field of MUF material both domestically and internationally in recent years was reviewed.From the development of advanced FC packaging technology to the performance requirements of MUF materials,the structural design of MUF material composition,and the current research and application status of mainstream MUF materials in FC packaging application were elaborated in several aspects.At last,the future developing trends of MUF materials in advanced FC packaging technology were prospected.

关 键 词：集成电路封装 倒装芯片 模塑型底填料 环氧树脂 熔体流动性 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]