SiC功率模块封装材料的研究进展  

作　　者：程书博[1] 张金利[1] 张义政 吴亚光[1] 王维 

机构地区：[1]中国电子科技集团公司第十三研究所,石家庄050000

出　　处：《科技创新与应用》2024年第3期106-109,共4页Technology Innovation and Application

摘　　要：随着SiC功率模块的高频高速、高压大电流、高温、高散热和高可靠发展趋势,基于封装结构和封装材料的SiC功率模块封装技术也在不断地更新换代。与封装结构相比,SiC功率模块封装材料的相关研究报道较少。该文从封装材料角度出发,综述近年来陶瓷覆铜基板、散热底板、黏结材料、互连材料及灌封材料的研究进展,同时引出相关封装材料的研究重点,以满足SiC功率模块的应用需求。With the development trend of high frequency,high speed,high voltage,high current,high temperature,high heat dissipation and high reliability of SiC power module,the packaging technology of SiC power module based on packaging structure and packaging materials is constantly updated.According to the packaging structure,there are few reports on SiC power module packaging materials.From the point of view of packaging materials,this paper summarizes the research progress of ceramic copper clad substrate,heat dissipation substrate,bonding materials,interconnection materials and filling materials in recent years,and leads to the research focus of related packaging materials to meet the application requirements of SiC power modules.

关 键 词：SiC功率模块 封装材料 陶瓷覆铜基板 散热底板 黏结材料 互连材料 灌封材料 

分 类 号：TB34[一般工业技术—材料科学与工程]