电子互连无铅钎料及焊点蠕变行为研究进展  

Development of Creep Behavior of Lead-free Solders and Solder Joints in Electronic Interconnection

作　　者：张亮 韩永典[2] 尹立孟[3] 胡小武[4] 孙磊[5] Zhang Liang;Han Yongdian;Yin Limeng;Hu Xiaowu;Sun Lei(School of Materials Science and Engineering,Xiamen University of Technology,Xiamen 361024,China;School of Materials Science and Engineering,Tianjin University,Tianjin 300350,China;.School of Metallurgy and Materials Engineering,Chongqing University of Science&Technology,Chongqing 401331,China;School of Mechanical Electrical Engineering,Nanchang University,Nanchang 330031,China;School of Mechanical Engineering and Rail Transit,University of Changzhou,Changzhou 213164,China)

机构地区：[1]厦门理工学院材料科学与工程学院,福建厦门361024 [2]天津大学材料科学与工程学院,天津300350 [3]重庆科技学院冶金与材料工程学院,重庆401331 [4]南昌大学机电工程学院,江南南昌330031 [5]常州大学机械与轨道交通学院,江苏常州213164

出　　处：《稀有金属材料与工程》2023年第12期4307-4324,共18页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(52175288,52165047,51974198);福建省“闽江学者”特聘教授项目;河南省特聘研究员项目;江苏省自然科学基金(BK20211351,BK20210853)。

摘　　要：针对近年来无铅钎料及焊点的蠕变失效问题,综合评述了蠕变变形行为及其在焊点可靠性评估中的应用。首先系统地介绍无铅钎料的蠕变行为,探讨含合金元素/颗粒无铅钎料蠕变性能改性机制。其次评述焊点蠕变行为,探讨焊点成分以及不同基板材料对焊点蠕变特性影响的研究进展。再次结合具体电子器件,采用有限元模拟,分析基于有限元的焊点蠕变响应及疲劳寿命预测,评估焊点可靠性。最后针对无铅钎料及焊点蠕变行为的未来发展进行展望,分析其研究中存在的问题及解决办法,为焊点可靠性进一步研究提供理论支撑。For the creep failure of lead-free solders and solder joints in recent years,the creep deformation behavior and its application in reliability of solder joint were reviewed.Firstly,the creep behavior of lead-free solders was systematically introduced,and the creep modification mechanism of lead-free solders bearing alloying elements or particles was discussed.Secondly,the creep behavior of solder joints was reviewed,and the research progress about the influence of solder joint composition and substrate materials on the creep behavior of solder joints was analyzed.Furthermore,for specific electronic devices,the creep response and fatigue life prediction of solder joints based on finite element method were analyzed by finite element simulation,and the reliability of solder joints was evaluated.Finally,the future development of creep behavior of lead-free solder and solder joint was prospected,and the existing problems and solutions were analyzed to provide theoretical support for further research on solder joint reliability.

关 键 词：无铅钎料 焊点 蠕变行为 蠕变疲劳寿命 可靠性 

分 类 号：TG425[金属学及工艺—焊接]