SnCu和SnAgCu系无铅焊料的氧化行为研究  

Study on Oxidation Behavior of Sn Cu and Sn AgCu Series Lead-Free Solder

作　　者：梁华鑫 唐芸生 杨炜沂 贾元伟 张家涛 LIANG Huaxin;TANG Yunsheng;YANG Weiyi;JIA Yuanwei;ZHANG Jiatao(Yunnan Tin Group(Holding)Company Limited R&D Center,Kunming 650106,China;School of Material Science and Engineering,Southwest Jiaotong University,Chengdu 610031,China)

机构地区：[1]云南锡业集团(控股)有限责任公司研发中心,云南昆明650106 [2]西南交通大学材料科学与工程学院,四川成都610031

出　　处：《热加工工艺》2023年第21期118-120,127,共4页Hot Working Technology

基　　金：云南省稀贵金属材料基因工程项目(202002AB080001)。

摘　　要：SnCu和SnAgCu系无铅焊料在熔化及波峰焊过程中会产生锡渣,影响焊料的流动性、润湿性等,最终影响焊料的使用。选取市场上常见的SnCu和SnAgCu系无铅焊料产品,在270℃进行喷流氧化实验。通过对原始的焊料组成以及氧化实验获得渣样的物相和元素组成进行分析来研究杂质元素对系列无铅焊料抗氧化性性能的影响。结果表明,氧化实验后,Al、Ca、Fe和Si等亲氧元素会在渣中富集,从而降低无铅焊料的抗氧化性能。It can produce tin slag in the process of melting and wave soldering of SnCu and SnAgCu lead-free solders,which affects the fluidity and wettability of solder,and ultimately affects the use of solder.Selecting the market common used lead-free solder products SnCu and SnAgCu,the jet oxidation experiments at 270℃were carried out.Through the analysis of original solder composition and phase and element composition of slag after jet oxidation experiment,the effect of impurity elements on the oxidation resistance of lead-free solders was studied.The experimental results show that after the oxidation experiments,aerophilic elements such as Al,Ca,Fe and Si can be enriched in the slag,thus reducing the oxidation resistance of lead-free solder.

关 键 词：SnCu SNAGCU 无铅焊料 氧化行为 

分 类 号：TG425.1[金属学及工艺—焊接]