基于ARM+FPGA双核异构的SiP设计  

Design of Dual-Core Heterogeneous SiP Based on ARM+FPGA

作　　者：车岩 CHE Yan(The 47th Institute of China Electronics Technology Group Corporation,Shenyang 110000,China)

机构地区：[1]中国电子科技集团公司第四十七研究所,沈阳110000

出　　处：《微处理机》2024年第1期15-18,共4页Microprocessors

摘　　要：为满足未来嵌入式计算机发展的小型化需求,对电子系统小型化的关键技术SiP展开探索,介绍一款基于ARM+FPGA双核异构的SiP产品的设计过程。该SiP产品由FPGA裸芯、基于ARM Cortex-M4的MCU裸芯、flash裸芯、电平转换功能裸芯、RS422收发器裸芯以及若干阻容分立器件组成。所有的裸芯通过先进封装技术,以基板为载体集成到一个模块中,以节约印制电路板面积并降低成本,有助于降低硬件工程师设计工作难度,实现了嵌入式板卡的小型化和高集成化。SiP模块封装结构采用PBGA的封装,以四层BT基板为载体,采用塑封工艺,大幅度减小模块尺寸。In order to meet the miniaturization requirements of embedded computer development in the future,the key technology of electronic system miniaturization,SiP,is explored,and the design process of a dual-core heterogeneous SiP product based on ARM+FPGA is introduced.The SiP product consists of FPGA bare core,MCU bare core based on ARM Cortex-M4,flash bare core,level shifting bare core,RS422 transceiver bare core and several resistance-capacitance discrete devices.All bare cores are integrated into a module with the substrate as the carrier through advanced packaging technology,so as to save the printed circuit board area and reduce the cost,help to reduce the design difficulty of hardware engineers,and realize the miniaturization and high integration of embedded boards.The package structure of SiP module adopts PBGA package,with four-layer BT substrate as the carrier and plastic packaging technology,which greatly reduces the module size.

关 键 词：系统级封装 PBGA封装 BT基板 

分 类 号：TN405[电子电信—微电子学与固体电子学]