有机封装基板界面处理工艺对结合强度与可靠性的影响  

Effect of Interface Processing Technology on Bonding Strength and Reliability of Organic Package Substrate

作　　者：梁梦楠 陈志强 张国杰 姚昕 李轶楠 张爱兵 LIANG Mengnan;CHEN Zhiqiang;ZHANG Guojie;YAO Xin;LI Yi′nan;ZHANG Aibing(Wuxi Zhongwei High-Tech Electronics Co.,Ltd.,Wuxi 214035,China)

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子与封装》2024年第2期34-40,共7页Electronics & Packaging

基　　金：科技部重点研发计划(2020YFB1807303)。

摘　　要：封装基板分层是塑封电路常见的一种失效模式,塑封基板分层会导致整个电路出现开路问题。基板分层通常与其界面间结合强度不足、基板水汽等有关。研究了铜表面的粗化处理、味之素堆积膜(ABF)表面的等离子清洁对铜和ABF表面的形貌、粗糙度以及界面间结合的影响,粗化后的铜表面与ABF树脂的剥离界面分析结果证明界面间断裂失效属于物理结合力失效。同时还对基板加工过程的吸水率及不同烘烤参数对除水效果的影响进行了研究。通过引入铜面粗化处理、等离子清洁和增层前烘烤,解决了基板封装后出现分层的问题,同时封装后的产品通过了部分热可靠性测试。Package substrate delamination is a common failure mode in the plastic packaged circuit,and plastic package substrate delamination will lead to open circuit problem throughout the circuit.Substrate delamination is usually related to weak bonding strength between interfaces and moisture in the substrate.Effects of roughening of the copper surface and plasma cleaning of the Ajinomoto buildup film(ABF)surface on the morphology,roughness and interfacial bonding of the copper and the ABF surface are studied.Analysis results of the stripping interfaces between the roughened copper surfaces and ABF resins show that the fracture failure between interfaces is a physical bonding failure.At the same time,the water absorption during substrate processing and the influence of different baking parameters on the water removal effect are also investigated.Through the introduction of copper surface roughening treatment,plasma cleaning and baking before lamination,the problem of delamination after substrate package is solved,while the packaged products pass some thermal reliability tests.

关 键 词：封装基板 味之素堆积膜 粗化处理 等离子清洁 封装可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]