基于有机基板的化学镍钯浸金工艺应用与测评  

Application and Evaluation of Chemical Nickel-Palladium Immersion Gold Process Based on Organic Substrates

作　　者：刘彬灿 李轶楠 LIU Bincan;LI Yi′nan(Samcien Semiconductor Materials Co.,Ltd.,Shenzhen 518000,China;Wuxi Zhongwei High-Tech Electronics Co.,Ltd.,Wuxi 214035,China)

机构地区：[1]深圳市化讯半导体材料有限公司,广东深圳518000 [2]无锡中微高科电子有限公司,江苏无锡214035

出　　处：《电子与封装》2024年第2期72-76,共5页Electronics & Packaging

摘　　要：有机基板被广泛应用于电子封装领域,常见的表面处理工艺包括电镀镍金、化学镍金、浸锡、浸银等工艺。在众多表面处理工艺中,化学镍钯浸金工艺因其具有较好的综合性能展现出显著优势。化学镍钯浸金工艺是在化学镍金工艺的基础上增加化镀钯处理,采用该工艺先对基板表面进行化镀镍处理,再进行化镀钯处理,最后完成化学浸金处理。钯镀层可以防止金在沉积过程中腐蚀镍镀层以及阻挡镍向金属间化合物(IMC)层扩散。利用X-Ray、电子扫描显微镜(SEM)、聚焦离子束(FIB)等图像分析方法,对比了不同厂商的化学镍钯浸金镀层的厚度、微观形貌及质量,结果表明,平整且致密的钯镀层可以有效避免镍腐蚀现象。Organic substrates are widely used in the field of electronic packaging,and common surface treatment processes include electroplating nickel-gold,chemical nickel-gold,immersion tin,immersion silver and other processes.Among the various surface treatment processes,the chemical nickel-palladium immersion gold process shows significant advantages due to its good comprehensive performance.Chemical nickel-palladium immersion gold process is based on the chemical nickel-gold process with the addition of chemical palladium plating treatment.This process first performs chemical nickel plating treatment on the substrate surface,followed by chemical palladium plating treatment,and finally completes the chemical immersion gold treatment.The palladium coating can prevent the gold from corroding the nickel coating during deposition process and prevent nickel from diffusing into the intermetallic compound(IMC)layer.By using X-Ray,scanning electron microscopy(SEM),focused ion beam(FIB)and other image analysis methods,the thickness,micro-morphology and quality of chemical nickel-palladium immersion gold coatings from different manufacturers are compared,and the results show that the flat and dense palladium coating can effectively avoid the nickel corrosion phenomenon.

关 键 词：表面处理工艺 化学镍钯浸金工艺 有机基板 镍腐蚀 

分 类 号：TN305.94[电子电信—物理电子学]