集成电路有机基板倒装焊失效分析与改善  

Failure Analysis and Improvement of Flip Chip of Organic Substrate for Integrated Circuit

作　　者：朱国灵 韩星 徐小明 季振凯 ZHU Guoling;HAN Xing;XU Xiaoming;JI Zhenkai(East Technology,Inc.,Wuxi 214072,China)

机构地区：[1]无锡中微亿芯有限公司,江苏无锡214072

出　　处：《电子与封装》2024年第2期77-81,共5页Electronics & Packaging

摘　　要：为了满足产品便携化和多功能化的需求,芯片设计正朝着多功能和大规模集成的趋势发展,集成电路封装也逐步向大尺寸、高密度的方向演进,特别是倒装芯片技术的应用,可以实现更高的封装密度和更快的信号传输速度。然而,不同材料的热膨胀系数存在差异,热失配容易引发互联凸点开路失效。为研究有机基板倒装焊集成电路在封装制程中失效的原因,采用扫描电子显微镜(SEM)结合有限元分析法,模拟有机基板在温度循环和回流焊过程中的应力分布状态并进行分析,结果表明,在回流焊过程中有机基板四周边缘位置的凸点所受应力较大。采用磁性载具和在焊盘上预制焊料的方法可以显著降低电路失效风险。In order to meet the demands for product portability and multifunctionality,chip design is developing towards the trend of multifunctionality and large-scale integration,and integrated circuit packaging is gradually evolving towards large size and high density.In particular,the application of flip chip technology can achieve higher packaging density and faster signal transmission speed.However,there are differences in the coefficients of thermal expansion of different materials,and thermal mismatch can easily lead to open-circuit failure of interconnection bumps.In order to study the reasons for the failure of flip chip of the organic substrate for integrated circuit in the packaging process,scanning electron microscopy(SEM)combined with finite element analysis is used to simulate and analyze the stress distribution state of the organic substrate in the temperature cycling and reflow soldering process,and the results show that the bumps around the edges of the organic substrate are subjected to a higher level of stress during reflow soldering process.The use of magnetic carriers and the prefabricated solder on pads can significantly reduce the risk of circuit failure.

关 键 词：有机基板 互联凸点 有限元分析 开路失效 

分 类 号：TN305.94[电子电信—物理电子学]