AMB陶瓷基板铝线键合强度的研究  

Study on bonding strength of aluminum wire on AMBceramic substrate

作　　者：郭珍云 王强 黄建国 谭永红 Guo Zhenyun;Wang Qiang;Huang Jianguo;Tan Yonghong

机构地区：[1]深圳市博敏电子有限公司,广东深圳518103

出　　处：《印制电路资讯》2024年第1期94-97,共4页Printed Circuit Board Information

摘　　要：AMB陶瓷基板铝线键合强度对IGBT功率模块的可靠性影响非常大,通常此类产品的可靠性测试项目包括机械振动、机械冲击、高温老化、低温老化、温度循环和功率循环等。长时间的机械和温度循环实验很容易导致键合线脱落和断裂,而键合线失效会直接导致模块无法正常工作。为了提高IGBT功率模块的可靠性,在实际的AMB陶瓷基板生产过程中,就需要控制好产品的铝线键合强度。本文从分析铝线焊点的根部断裂过程和机理入手,结合生产实际,针对铝线关键焊接参数对键合强度的影响程度进行研究,对实验结果使用数理统计的方法进行分析计算,得到了比较稳定的工艺参数。The bonding strength of AMB ceramic substrate aluminum wire has a great impact on the reliability of IGBT power modules.Generally,the reliability test items of such products include mechanical vibration,mechanical shock,high temperature aging,low temperature aging,Temperature cycling and power cycle.Long time mechanical and Temperature cycling experiments can easily lead to the fall off and fracture of the bonding line,and the failure of the bonding line will directly lead to the failure of the module.In order to improve the reliability of IGBT power modules,it is necessary to control the aluminum wire bonding strength of the product in the actual production process of AMB ceramic substrates.This article starts with the analysis of the root fracture process and mechanism of aluminum wire solder joints,and combines with production practice to study the impact of key welding parameters on bonding strength of aluminum wire.The experimental results are analyzed and calculated using mathematical statistics methods,and relatively stable process parameters are obtained.

关 键 词：IGBT 陶瓷基板 键合强度 铝线 焊接参数 

分 类 号：TN3[电子电信—物理电子学]