金丝球焊近壁键合技术  

Near-wall Bonding Technology of Gold Wire Ball-Wedge Bonding

作　　者：张路非 晏海超 李席安 何学东 夏念 ZHANG Lufei;YAN Haichao;LI Xi’an;HE Xuedong;XIA Nian(GuiZhou ZhenHua QunYing Electric Appliance Co.,Ltd.,Guiyang 550000,China)

机构地区：[1]贵州振华群英电器有限公司,贵阳550000

出　　处：《电子工艺技术》2024年第2期29-32,36,共5页Electronics Process Technology

摘　　要：在引线键合工艺应用中,由于球焊键合工艺具有键合方向灵活、键合速度快等优势,在半导体芯片的封装互联领域被广泛应用。针对金丝球焊键合工艺中的近壁键合问题进行了研究,从键合方式、劈刀设计两个方面进行优化、改进,制定了两种不同的解决方案,并分析了两种方案的应用局限性。In the application of wire bonding,the ball-wedge bonding is widely used in the field of packaging and interconnection of semiconductor chips due to its advantages such as flexible bonding direction and fast bonding speed.The near-wall bonding problem in the gold wire ball bonding process is studied,and two different solutions are formulated from the two aspects of bonding method and capillary design,and the application limitations of the two schemes are analyzed.

关 键 词：引线键合 金丝球焊 近壁键合 深腔键合 复合键合 

分 类 号：TN405[电子电信—微电子学与固体电子学]