细间距QFN器件焊接工艺设计  

Soldering Process of QFN Device with Fine Pitch

作　　者：李亚飞 张钧翀 黄莹 董姝 唐盘良 陈彦光 马晋毅 LI Yafei;ZHANG Junchong;HUANG Ying;DONG Shu;TANG Panliang;CHEN Yanguang;MA Jinyi(The 26th Research Institute of CETC,Chongqing 400060,China)

机构地区：[1]中国电子科集团公司第二十六研究所,重庆400060

出　　处：《电子工艺技术》2024年第2期37-40,共4页Electronics Process Technology

摘　　要：QFN器件体积小、质量轻、电性能及散热性能好,广泛应用于高可靠电路中。由于底部散热焊盘面积较大,极易产生焊接空洞问题。特殊的封装制程使得QFN焊端侧面裸铜,暴露空气氧化后难以爬锡。针对上述问题,从PCB焊盘设计、焊膏印刷及回流焊接等方面展开试验,对比QFN器件侧面焊盘爬锡、底部焊盘空洞率等情况,优化了QFN器件组装效果,提高了QFN器件的应用可靠性。QFN device are widely used in highly reliable circuits because of their small size,light weight,good electrical and heat dissipation performance.Due to the large area of the bottom heat dissipation pad,it is easy to generate voids.The special process method makes it difficult for bare copper on the side of the soldering end to climb tin after oxidation.In response to the above problems,the test is carried out from PCB pad design,solder paste printing and reflow soldering.By comparing the solder climbing of the side pad and the void rate of the bottom pad of QFN devices,the results of QFN device assembly are optimized and the application reliability of QFN device is improved.

关 键 词：QFN器件 焊盘设计 焊膏印刷 回流焊 

分 类 号：TN605[电子电信—电路与系统]