脉冲电镀复合波形对孔铜和拐角铜深镀能力的影响  

Effect of pulse electroplating composite waveform on deep plating ability of hole copper and corner copper

作　　者：莫晓锰 陈正军 Mo Xiaomeng;Chen Zhengjun

机构地区：[1]江西博泉化学有限公司,江西吉安331603

出　　处：《印制电路资讯》2024年第2期87-91,共5页Printed Circuit Board Information

摘　　要：本文介绍脉冲电镀复合波形参数对通孔板孔中铜厚和拐角铜厚深镀能力的影响,通过对单一波形和复合波形进行对比研究发现复合波形取得的深镀能力比单一波形更好。同时对复合波形中的反向电流和正反向脉冲宽度(时间)对通孔的镀通率做了详细探究,调整复合波形控制脉冲电镀过程中反向电流的大小和正反脉冲宽度(时间),能够调节高厚径比通孔的孔中铜厚和拐角铜厚的深镀能力,其中随着反向电流的增大,孔中铜厚深镀能力逐渐提高,但拐角铜厚深镀能力会有所降低;而随着正反脉冲宽度增加,拐角铜厚深镀能力逐渐降低,但孔中铜厚深镀能力会呈现先增加再降低的抛物线趋势。This paper introduces the effect of pulse electroplating composite waveform parameters on the deep plating ability of copper thickness and corner copper thickness in through hole plate.Through comparative study of single waveform and composite waveform,it is found that the deep plating ability of composite waveform is better than that of single waveform.At the same time,the reverse current and positive and negative pulse width(time)in the composite waveform are studied in detail.By adjusting the reverse current and positive and negative pulse width(time)in the pulse electroplating process,the deep plating ability of the copper thickness in the hole and the corner copper thickness can be adjusted.With the increase of the reverse current,the copper thickness and deep plating ability in the hole gradually increases,but the copper thickness and deep plating ability at the corner decreases.With the increase of pulse width,the copper thickness and deep plating ability at the corner decreased gradually,but the copper thickness and deep plating ability in the hole showed a parabolic trend of first increasing and then decreasing.

关 键 词：脉冲电镀 复合波形 深镀能力 孔口凹陷 脉冲宽度 

分 类 号：G63[文化科学—教育学]