功率模块封装设计中的电磁干扰抑制分析  

Analysis of Electromagnetic Interference Suppression in Power Module Packaging Design

作　　者：江加丽 JIANG Jiali(China Zhenhua Group Yongguang Electronics Co.,Ltd.,Guizhou 550018,China)

机构地区：[1]中国振华集团永光电子有限公司,贵州550018

出　　处：《集成电路应用》2024年第3期48-49,共2页Application of IC

摘　　要：阐述电磁干扰对功率模块的影响,设计电磁干扰抑制的方法,分析抑制方法的预期效果。实验结果表明,该方法能显著减少功率模块对电磁环境的干扰,从而提高整体系统的稳定性和性能。This paper describes the impact of electromagnetic interference on power modules,designs methods for electromagnetic interference suppression,and analyzes the expected effects of the suppression methods.The experimental results show that this method can significantly reduce the interference of power modules on the electromagnetic environment,thereby improving the stability and performance of the overall system.

关 键 词：电磁干扰 功率模块 封装设计 实验验证 

分 类 号：TN386[电子电信—物理电子学]