光刻制程中的核心工艺技术综述  

Overview of Core Process Technologies in Photolithography Process

作　　者：曲征辉 QU Zhenghui(Shenyang Xinyuan Microelectronics Equipment Co.,Ltd.,Liaoning 110001,China)

机构地区：[1]沈阳芯源微电子设备股份有限公司,辽宁110001

出　　处：《集成电路应用》2024年第3期68-69,共2页Application of IC

摘　　要：阐述光刻制程的核心工艺技术,分析各工艺步骤特点及异常情况,包括气相成底膜、涂布、前烘、曝光、曝光烘烤、显影、硬烘、检验工序,为未来进一步工艺研究与生产制造提供理论依据。This paper describes the core process technology of photolithography,analyzes the characteristics and abnormal situations of each process step,including gas-phase film formation,coating,pre drying,exposure baking,development,hard drying,and inspection processes.It provides a theoretical basis for further process research and production manufacturing in the future.

关 键 词：集成电路 光刻工艺 涂胶 显影 烘烤 

分 类 号：TN405[电子电信—微电子学与固体电子学]