基于塑封的加速度计无引线键合封装设计  

Design of Leadless Bonding Package for Accelerometers Based on Plastic Sealing

作　　者：焦静静 段国栋 任延超 王鸿睿 刘甜 JIAO Jingjing;DUAN Guodong;REN Yanchao;WANG Hongrui;LIU Tian(Hunan Yunjian Group Co.,Ltd.,Changsha,Hunan 410100,China)

机构地区：[1]湖南云箭集团有限公司,湖南长沙410100

出　　处：《自动化应用》2024年第8期200-202,共3页Automation Application

摘　　要：针对MEMS中传统陶瓷封装造成的封装体积大以及耦合问题,设计了一种基于塑封的加速度计无引线键合封装,该封装通过阳极键合和各向异性导电胶实现无引线封装。对敏感结构进行力学分析,求解敏感结构在量程下的最大振动位移为6.4μm,从而优化封装结构。阐述基于塑封的加速度计无引线键合封装的工艺路线,经仿真验证,该封装有效缩小了封装尺寸,提高了封装效率,增加了MEMS加速度计封装的可靠性。A lead-free bonding package for accelerometers based on plastic packaging was designed to address the issues of large packaging volume and coupling caused by traditional ceramic packaging in MEMS.The package achieves lead-free packaging through anodic bonding and anisotropic conductive adhesive.Perform mechanical analysis on sensitive structures and determine that the maximum vibration displacement of the sensitive structure at the range is 6.4μm.Thus optimizing the packaging structure.Elaborate on the process route of lead-free bonding packaging for accelerometers based on plastic packaging.After simulation verification,this packaging effectively reduces the packaging size,improves packaging efficiency,and increases the reliability of MEMS accelerometer packaging.

关 键 词：微机电系统 加速度计 封装 无引线键合 

分 类 号：TP305[自动化与计算机技术—计算机系统结构]