高温环境用陶瓷封装外壳研究  

Research on the Ceramic Packages for High Temperature Environments

作　　者：杨振涛 余希猛 段强 淦作腾[1] 张志忠[1] YANG Zhentao;YU Ximeng;DUAN Qiang;GAN Zuoteng;ZHANG Zhizhong(No.13 Research Institute of China Electronics Technology Group Corporation,Shijiazhuang 050051,China)

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《电子质量》2024年第4期75-79,共5页Electronics Quality

摘　　要：主要对高温电子器件的应用领域和高温封装用陶瓷封装外壳的研究进展进行了介绍,同时对传统陶瓷外壳的高温性能进行了研究。研究结果表明,传统陶瓷外壳的材料及金属化体系在高温环境下会发生显著变化,外壳寄生参数会随着环境温度的升高而增大,长时间的高温环境还会导致外壳金层氧化变色、金层与陶瓷间分层和产生气泡甚至脱落等问题,无法满足高温环境的使用需求。因此,需要开发出一种新的金属化体系和与之相匹配的材料体系,来解决现有陶瓷外壳在高温环境下无法使用的技术问题。The application fields of high-temperature electronic devices and research progress of ceramic package for high temperature packaging is introduced,and the high-temperature performance of traditional ceramic packages is studied.Research results indicate that the materials and metallization systems of traditional ceramic packages will undergo significant changes in high-temperature environments.The parasitic parameters of ceramic packages will increase with the increase of the ambient temperature.Prolonged exposure to high temperatures also leads to oxidation and discoloration of the gold layer of the shell,delamination between the gold layer and ceramic,formation of bubbles,and even shedding.These issues prevent the ceramic packages from meeting the requirements of high-temperature environments.Therefore,it is necessary to develop a new metallization system and a compatible material system to solve the technical problem that the existing ceramic shell can not be used in high temperature environment.

关 键 词：高温电子器件 封装 陶瓷外壳 高温环境 

分 类 号：TN305.94[电子电信—物理电子学]