硅基三维异构集成射频微系统的多物理场耦合仿真与设计  

Multi-physics coupling simulation of silicon-based 3D heterogeneous integrated RF microsystems

作　　者：张睿 朱旻琦 杨兵[2] 冯政森 王辂 张先荣[1] 陆宇 蔡源 邱钊[1] Zhang Rui;Zhu Minqi;Yang Bing;Feng Zhengsen;Wang Lu;Zhang Xianrong;Lu Yu;Cai Yuan;Qiu Zhao(The 10th Research Institute of China Electronics Technology Group Corporation,Chengdu 610036,China;The 58th Research Institute of China Electronics Technology Group Corporation,Wuxi 214000,China)

机构地区：[1]中国电子科技集团公司第十研究所,四川成都610036 [2]中国电子科技集团公司第五十八研究所,江苏无锡214000

出　　处：《电子技术应用》2024年第5期1-6,共6页Application of Electronic Technique

基　　金：国家自然科学基金(62301518);中国博士后科学基金面上项目(2022M722962)。

摘　　要：利用硅基三维异构集成工艺设计一款射频微系统,以满足设备对射频模组高性能、小型化的需求。为了在设计初期充分评估该微系统的潜在可靠性风险,根据工艺特征以及产品在多物理场中的耦合现象,建立一种面向硅基三维异构集成工艺射频微系统的多物理场一体化仿真流程,逐一分析所涉及的电-热耦合和热-力耦合过程,预判产品在工作条件下的热学和力学特性,为设计环节提供针对性的指导,预先规避可靠性风险,从而有效提高一次性设计成功率。We designed an RF microsystem by using silicon-based three-dimensional heterogeneous integration process to meet the requirements of high performance and miniaturization of RF modules.To fully evaluate the potential reliability risk of the microsystem in the early stage of design,we establish a multi-physics integrated simulation process for this RF microsystem according to the process characteristics and the multi-physics coupling phenomenon.Then we analyze the electro-thermal and thermal-mechanical coupling processes involved,predict the thermal and mechanical characteristics of the product under working conditions,provide targeted guidance for the design process,and avoid reliability risks in advance,so as to effectively improve the success rate of one-time design.

关 键 词：硅基三维异构集成射频微系统 多物理场耦合仿真 电-热耦合 热-力耦合 

分 类 号：TN453[电子电信—微电子学与固体电子学]