应用于封装凸块的亚硫酸盐无氰电镀金工艺  

Cyanide-free sulfite-based gold electroplating for microbump fabrication in packaging

作　　者：焦玉 李哲 任长友 邓川 王彤 刘志权 JIAO Yu;LI Zhe;REN Changyou;DENG Chuan;WANG Tong;LIU Zhiquan(Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China;Shenzhen United Blue Ocean Applied Materials Technology Co.,Ltd.,Shenzhen 518022,China)

机构地区：[1]中国科学院深圳先进技术研究院,广东深圳518055 [2]深圳市联合蓝海应用材料科技股份有限公司,广东深圳518022

出　　处：《电镀与涂饰》2024年第5期39-45,共7页Electroplating & Finishing

基　　金：广东省重点领域研发计划电子化学品重点专项(2023B0101010002);深圳市高层次人才创新创业计划重大技术攻关团队(JSGGKQTD20221101115650008)。

摘　　要：[目的]在工业可持续发展战略下,环保无氰电镀金技术正逐步替代传统氰化物电镀金技术,并在微电子封装领域中得到推广应用。[方法]针对液晶驱动芯片封装晶圆电镀金凸块工艺制程,开发出一种新型亚硫酸盐无氰电镀金配方和工艺。[结果]自研无氰电镀金药水中添加了有机膦酸添加剂和晶体调整剂,前者能够充分抑制镍金置换,后者有助于形成低应力的等轴晶组织,可避免施镀过程中国产光刻胶挤出变形现象。该自研无氰电镀金工艺应用于晶圆时可获得微观表面平整均匀和无缺陷的金凸块。[结论]该自研无氰电镀金工艺能够满足晶圆级封装的要求,具备很好的推广应用潜力。[Introduction]Under the strategy of sustainable industrial development,the environmentally friendly cyanide-free gold electroplating technology is gradually replacing the traditional cyanide-based gold electroplating technology,and has been widely applied in the field of microelectronic packaging.[Method]A novel cyanide-free sulfite-based bath composition for gold electroplating was developed in respect of the gold microbumping process in liquid crystal display(LCD)driver chip packaging.[Result]Organic phosphonic acid and crystal adjusting agent were added to the self-developed cyanide-free electroplating solution.The former could efficiently inhibit nickel-gold replacement,while the latter helped to form equiaxial crystals with low stress,avoiding extrusion and deformation of photoresist during gold electroplating.Gold microbumps with smooth and uniform microscopic surface and free of defects could be obtained on wafer by the given cyanide-free gold electroplating process.[Conclusion]The cyanide-free gold electroplating process can meet the requirements of wafer-level packaging,showing great potential in industrial applications.

关 键 词：电子封装 金微凸块 无氰电镀 镍金置换 微观结构 

分 类 号：TQ153.18[化学工程—电化学工业]