首次选用的典型裸芯片应用可靠性评价方法  

Application Reliability Evaluation Method for First Selection of Typical Bare Chip

作　　者：武荣荣 梅亮 任翔 曹阳 庞明奇 刘净月 WU Rongrong;MEI Liang;REN Xiang;CAO Yang;PANG Mingqi;LIU Jingyue(China Aerospace Science&Industry Corp.Defense Technology R&T Center,Beijing 100039,China)

机构地区：[1]航天科工防御技术研究试验中心,北京100039

出　　处：《电子与封装》2024年第5期25-28,共4页Electronics & Packaging

摘　　要：受装备尺寸及重量的限制,在设备多功能、高精度、高可靠性的需求下,装备开始采用裸芯片代替封装后的器件。直接应用生产好未经过封装的芯片,在一定程度上降低了成本,但没有封装保护的裸芯片对质量与可靠性提出了更高的要求。首次选用时,基于对裸芯片应用可靠性的风险分析,设计了可靠性评价项目,完成了评价方案的制定,对裸芯片功能/性能、可靠性及适应性等方面进行评估摸底。实践结果证明,基于风险分析的应用可靠性评价方法能有效避免有质量风险或可靠性不满足要求的器件上装应用。Restricted by size and weight of the equipment,under equipment demand of multi-function,high precision and high reliability,the equipment begins to use bare chips instead of packaged devices.The direct application of bare chips without packaging has brought partly cost reduction,but the bare chips without packaging protection have put forward higher requirements for quality and reliability.At the time of the first selection,based on the risk analysis of the reliability of the bare chip application,the reliability evaluation project is designed,the evaluation program is completed,the function/performance,reliability and adaptability of the bare chips are evaluated and mapped.The application reliability evaluation method based on risk analysis can effectively avoid the device application with quality risk or reliability not meeting the requirements.

关 键 词：裸芯片 首次选用 应用可靠性 评价 

分 类 号：TN406[电子电信—微电子学与固体电子学]