基于低粗糙度酸腐蚀片制备的精密研磨工艺研究  

Research on Precision Grinding Process Based on Low Roughness Acid Corrosion Tablet Preparation

作　　者：王玉臣[1] WANG Yuchen(The 46th Research Institute of CETC,Tianjin 300220,China)

机构地区：[1]中国电子科技集团公司第四十六研究所,天津300220

出　　处：《电子工业专用设备》2024年第3期16-19,共4页Equipment for Electronic Products Manufacturing

摘　　要：讨论了精密研磨工艺对低粗糙度酸腐蚀片的影响,提出了采用细砂精密研磨的方式,并相应研究了精密研磨去除量、助磨剂加入量等参数对低粗糙度酸腐蚀片加工的影响。采用小粒径白刚玉研磨硅片可有效降低硅片的表面粗糙度,增加细砂研磨时助磨剂的加入量可有效减少划伤。This article discusses the influence of precision grinding technology on low roughness acid corroded sheets,proposes the use of fine sand precision grinding method,and correspondingly studies the influence of parameters such as precision grinding removal amount and grinding aid addition amount on the processing of low roughness acid corroded sheets.Decreasing the particle size of the white corundum can effectively reduce the surface roughness of the wafers,and increasing the amount of grinding aids added during fine sand grinding can effectively reduce scratches.

关 键 词：硅片 研磨 低粗糙度 

分 类 号：TN305[电子电信—物理电子学]