面向Chiplet集成的三维互连硅桥技术  

3D Interconnect Silicon Bridge Technology for Chiplet Integration

作　　者：赵瑾[1] 于大全 秦飞[1] ZHAO Jin;YU Daquan;QIN Fei(School of Mathematical Statistics and Mechanics,Beijing University of Technology,Beijing 100124,China;School of Electronic Science and Engineering,Xiamen University,Xiamen 361005,China;Xiamen Sky Semiconductor Technology Co.,Ltd.,Xiamen 361013,China)

机构地区：[1]北京工业大学数学统计学与力学学院,北京100124 [2]厦门大学电子科学与技术学院,福建厦门361005 [3]厦门云天半导体科技有限公司,福建厦门361013

出　　处：《电子与封装》2024年第6期1-11,I0003,共12页Electronics & Packaging

基　　金：国家自然科学基金联合基金(U2241222)。

摘　　要：摩尔定律的发展速度放缓和集成电路产品应用的多元化趋势,共同推动了先进封装技术的快速发展。先进互连技术是先进封装的核心,在高速、高频传输、功耗、超细节距互连以及系统集成能力等方面均展现出显著优势。硅桥技术作为Chiplet以及异构集成封装的重要解决方案,可以以较低的成本实现多芯片间的局部高密度互连,在处理器、存储器、射频器件中被广泛应用。介绍了业界主流的硅桥技术,并对硅桥技术的结构特点和关键技术进行了分析和总结。深入讨论了硅桥技术的发展趋势及挑战,为相关领域的进一步发展提供参考。Slowdown of Moore's Law and the trend towards diversification in IC product applications have combined to drive the rapid development of advanced packaging technology.Advanced interconnect technology is the core of advanced packaging,and it shows significant advantages in high-speed,high-frequency transmission,power consumption,ultra-fine pinch interconnect as well as the ability of system integration capability.As an important solution for Chiplet and heterogeneous integrated packaging,silicon bridge technology can achieve local high-density interconnections among multiple chips at low cost,and it is widely used in processors,memories,and radio frequency devices.The mainstream silicon bridge technologies in the industry are introduced,and the structural features and key technologies of silicon bridge technologies are analyzed and summarized.Meanwhile,the development trends and challenges of silicon bridge technology are discussed in depth to provide reference for further development in related fields.

关 键 词：先进互连技术 Chiplet 硅桥技术 高密度互连 

分 类 号：TN305.94[电子电信—物理电子学]