微电子封装产业的发展现状以及趋势分析  

Analysis of Development Status and Trend of Microelectronic Packaging Industry

作　　者：张凤 ZHANG Feng(Nanjing Microelectronics Co.,Ltd.,Jiangsu 210023,China)

机构地区：[1]南京微盟电子有限公司,江苏210023

出　　处：《集成电路应用》2024年第5期46-47,共2页Application of IC

摘　　要：阐述微电子封装产业中传统封装和先进技术的发展现状和技术对比,探讨封装产业发展在供应链和产业结构中的问题,提出微电子封装产业发展的对策建议,包括促进核心技术发展、加强人才培养。This paper expounds the current development status and technological comparison of traditional packaging and advanced technologies in the microelectronic packaging industry,explores the problems of packaging industry development in the supply chain and industrial structure,and proposes countermeasures and suggestions for the development of the microelectronic packaging industry,including promoting the development of core technologies and strengthening talent cultivation.

关 键 词：微电子封装 技术对比 产业结构 供应链 

分 类 号：TN405[电子电信—微电子学与固体电子学]