使用牺牲层优化PDMS微流控芯片打孔工艺  

Optimization of PDMS microfluidic chip punching process using sacrificial layers

作　　者：闫婷婷 李慧 孟晓帅 魏春阳 李姗姗[1,2,3] YAN Tingting;LI Hui;MENG Xiaoshuai;WEI Chunyang;LI Shanshan(School of Mechanical Engineering,Hebei University of Technology,Tianjin 300401,China;Hebei Key Laboratory of Robotic Sensing and Human-Robot Interactions,Tianjin 300130,China;State Key Laboratory of Reliability and Intelligence of Electrical Equipment,Tianjin 300132,China)

机构地区：[1]河北工业大学机械工程学院,天津300401 [2]河北省机器人传感与人机融合重点实验室,天津300130 [3]电工装备可靠性与智能化国家重点实验室,天津300132

出　　处：《传感器与微系统》2024年第7期118-121,共4页Transducer and Microsystem Technologies

基　　金：国家自然科学基金资助项目(51728502);天津市特殊支持青年拔尖人才(第三批180191);河北省重点研发计划资助项目(19271707D);河北省自然科学基金资助项目(E2020202101,F2021202001);河北省留学回国人员资助项目(C20200314,C20210337)。

摘　　要：聚二甲基硅氧烷(PDMS)在微流控芯片技术中有非常广泛的应用,PDMS弹性体打孔是芯片加工中重要的工作环节,打孔质量直接影响到样品的导入导出和产物收集等,而孔的质量受到芯片厚度和打孔器规格等因素的影响。一个标准的孔应当满足以下几个要素:尺寸可控;圆度好;无裂孔。研究发现:通过在打孔目标位置的上方或下方放置牺牲层,可使孔质量有所改善。本文对影响PDMS打孔质量的4个关键因素进行了系统性研究,通过正交实验获得了一系列PDMS孔图片,进而利用MATLAB程序对孔的图像进行后处理,分析了牺牲层对孔质量的影响,确定了最优打孔工艺参数。结果表明,打孔时紧贴芯片的上下表面放置厚度2mm的软材质作为牺牲层可有效提高孔的质量。Polydimethylsiloxane(PDMS)is widely used in microfluidic chip technology.PDMS elastomer punching is an important part of microfluidic chip fabricating.The quality of punching directly affects the inflow and outflow of sample and product collection.The quality of hole is influenced by many factors,such as the thickness of chip and the aperture of puncher.A standard hole should meet the following elements:controlled size,good roundness and no cracks.It is found that the hole quality will be improved by placing sacrificial layers above or below the target punching position.Four key factors affecting the punching quality are systematically studied,and a series of images of PDMS holes are obtained through orthogonal experiments.Then,images are post-processed using the MATLAB program.The influence of the sacrificial layer on the hole quality is analyzed,and the optimal punching process parameters are obtained.The results show that the quality of holes can be effectively improved by placing thickness of 2 mm of soft material on the upper and lower sacrifice layers close to the chip during punching.

关 键 词：牺牲层 正交实验 参数优化 微加工工艺 

分 类 号：TN405[电子电信—微电子学与固体电子学]