VCP铁系脉冲电镀技术应用研究  

Research on the application of VCP ferrous series pulse electroplating technology

作　　者：林章清 王科 田茂江 章晓冬 刘江波 LIN Zhangqing;WANG Ke;TIAN Maojiang;ZHANG Xiaodong;LIU Jiangbo(Guangdong Skychem Technologies Co.,Ltd.,Guangzhou 511300,Guangdong,China;Shanghai Skychem Limited,Shanghai 201500,China)

机构地区：[1]广东天承科技股份有限公司,广东广州511300 [2]上海天承化学有限公司,上海201500

出　　处：《印制电路信息》2024年第8期27-33,共7页Printed Circuit Information

摘　　要：介绍一种垂直连续电镀(VCP)脉冲电镀铜技术,利用Fe2+/Fe3+氧化还原电子对技术,使用非析氧不溶性阳极,具有更好的生产稳定性和工艺操作控制。传统的可溶性阳极电镀过程中磷铜球表面会产生阳极膜和阳极泥,阳极泥累积到一定量时需暂停产线清理阳极泥并添加磷铜球,影响产线产量并消耗大量人力物力成本。铁系脉冲电镀铜技术只需产线外配置溶铜槽,定期补充纯铜粒,达到连续清洁生产的目的。此脉冲体系在应用过程中板厚小于3mm,纵横比小于15∶1的通孔深镀能力均达到90%以上,电镀时间小于60min。This article introduces a vertical conveyor plating(VCP)pulse electroplating copper technology.It uses Fe2+/Fe3+redox electron pair technology and non-oxygen-evolving insoluble anodes,so it has better production stability and process operation control.During the soluble anode plating process,an anode film will be formed on the surface of the phosphor copper ball.As time goes by,a large amount of anode sludge accumulates at the bottom of the titanium basket,blocking the anode and causing uneven thickness at the bottom of the cathode.When the anode sludge accumulates to a certain amount,it is required to cleaning the anode sludge and add phosphor copper balls,and the production line needs to be suspended which affects the output of the production line and consumes a lot of manpower and material costs.Iron-based pulse electroplating copper technology only requires a dissolving tank outside the production line and regular replenishment of pure copper particles to achieve the purpose of continuous clean production.During the application process of this pulse system,the plate thickness is less than 3 mm,the aspect ratio is less than 15:1,the throwing power reaches more than 90%,and the plating time is less than 60 min.

关 键 词：脉冲电镀 不溶性阳极 深镀能力 密集孔 

分 类 号：TN41[电子电信—微电子学与固体电子学]