半加成工艺中去钻污过程对剥离强度的影响  

Effect of Desmear on Peel Strength in Semi-additive Process

作　　者：林君逸 俞宏坤[1] 欧宪勋 程晓玲 林佳德 LIN Junyi;YU Hongkun;OU Xianxun;CHENG Xiaoling;LIN Jiade(Department of Materials Science,Fudan University,Shanghai 200433,China;Advanced Semiconductor Engineering(Shanghai)Ltd.,Shanghai 201203,China)

机构地区：[1]复旦大学材料科学系,上海200433 [2]日月光半导体(上海)有限公司,上海201203

出　　处：《集成电路应用》2024年第7期74-77,共4页Application of IC

摘　　要：阐述去钻污作为半加成工艺中关键的一个步骤,需要保证介质材料和铜层间的结合力在工艺完成后不会下降。通过拉力测试以及扫描电子显微镜、飞行时间二次离子质谱、X射线光电子能谱表征,分析去钻污工艺对样品树脂和铜层间的剥离强度的影响机制。结果表明,样品的失效模式为树脂的内聚破坏,经过去钻污工艺后树脂表面的孔洞发生破损,导致Mn、Cu等离子渗透进树脂内部,对树脂基体产生氧化作用从而降低树脂的内聚力。因此在实际生产中需要调整药水浓度等参数,防止破孔的发生。This paper expounds desmearisa critical step in the semi-additive process,and it is necessary to ensure that the adhesion between the dielectric material and the copper layer does not decrease after the desmear is completed.Through tensile testing,scanning electron microscopy,time-of-flight secondary ion mass spectrometry,and X-ray photoelectron spectroscopy,the influence mechanism of the desmear on the peel strength between the sample resin and copper layers was analyzed.The results show that the failure mode of the sample is the cohesion failure of the resin,and the holes on the surface of the resin are damaged after the desmear,resulting in the penetration of Mn and Cu plasma into the resin and the oxidation of the resin,thereby reducing the cohesion of the resin.Therefore,in actual production,it is necessary to adjust parameters such as the concentration of the reagents to prevent the occurrence of holes.

关 键 词：树脂 印制电路板 去钻污 剥离强度 失效模式 

分 类 号：TN41[电子电信—微电子学与固体电子学]