芯片级超宽带可重构阵列系统的架构设计  

Design of UWB Reconfigurable Array System Architecture Based on Chip Integration

作　　者：汪功兵 万祝娟 张璐 WANG Gongbing;WAN Zhujuan;ZHANG Lu(The 38th Research Institute of CETC,Anhui 230088,China;Tsinghua University,Beijing 100084,China)

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽230088 [2]清华大学,北京100084

出　　处：《集成电路应用》2024年第8期1-3,共3页Application of IC

摘　　要：阐述基于软件无线电的先进芯片集成工艺,对不同功能射频系统的子模块进行芯片级系统级封装(SiP)架构研究,从而满足未来通信装备对超宽带、可重构阵列、小型化的要求。This paper expounds the technology of software radio and advanced chip integration technology,and conducts research on the System in Package(SiP)architecture of chip-level integration of sub-modules of different functional RF systems,so as to meet the requirements of future communication equipment for ultra-wideband(UWB),reconfigurable arrays,and miniaturization.

关 键 词：电磁通信装备 射频处理系统 超宽带 可重构阵列 系统级封装 

分 类 号：TN402[电子电信—微电子学与固体电子学]