多层瓷介电容器的声学扫描检查分析  

Analysis of Acoustic Scanning Inspection of Multilayer Ceramic Capacitors

作　　者：聂延伟 NIE Yanwei(Xi'an Xigu Microelectronics Co.,Ltd.,Shaanxi 710077,China)

机构地区：[1]西安西谷微电子有限公司,陕西710077

出　　处：《集成电路应用》2024年第8期28-29,共2页Application of IC

摘　　要：阐述声学扫描检查(SAM)瓷介电容器内部缺陷的可行性,探讨多层瓷介电容器声学扫描检查研究目的及价值。介绍多层瓷介电容器内部空洞、分层及裂纹等缺陷的检测方法,并对结果进行验证。This paper describes the feasibility of acoustic scanning inspection(SAM)for detecting internal defects in ceramic capacitors,and explores the research purpose and value of acoustic scanning inspection for multi-layer ceramic capacitors.It introduces the detection methods for defects such as voids,delamination,and cracks inside multilayer ceramic capacitors,and verifies the results.

关 键 词：多层瓷介电容器 内部缺陷 声学扫描检查 

分 类 号：TN03[电子电信—物理电子学]