不同因素对OSP用于镀锡板时保护效果的影响  

Factors affecting the protection effectiveness of OSP when applied to tinplate

作　　者：周星辰 宋键 申熏 万传云 ZHOU Xingchen;SONG Jian;SHEN Xun;WAN Chuanyun(School of Chemical and Environmental Engineering,Shanghai Institute of Technology,Shanghai 201418,China;Wuxi Dingya Electronic Materials Co.,Ltd.,Wuxi 214000,China)

机构地区：[1]上海应用技术大学化学与环境工程学院,上海201418 [2]无锡鼎亚电子材料有限公司,江苏无锡214000

出　　处：《电镀与涂饰》2024年第9期60-68,共9页Electroplating & Finishing

摘　　要：[目的]以某市售有机可焊保护剂(OSP)为例,研究OSP在不同条件下对镀锡板的保护效果。[方法]通过中性盐雾试验、干/湿老化试验及可焊性测试,研究了镀锡板的基体材质、镍中间层的引入及其厚度、镀锡层的厚度及其种类对OSP保护效果的影响。[结果]当镀锡板采用锡铜合金为基材、1~2μm厚的镍为中间层及2~3μm厚的雾锡为外层时,OSP展现出最佳的保护效果。[结论]本文的研究结果可为企业选择镀锡板防护技术提供实验数据和指导。[Introduction]The protection effectiveness of organic solderability preservative(OSP)on tinplate under different conditions was studied with a commercially available OSP.[Method]The effects of substrate material,introduction of nickel intermediate layer with different thickness,and thickness of different kinds of tin coatings on the protection effectiveness of OSP were studied by neutral salt spray test,dry and wet aging tests,and solderability test.[Result]The OSP showed the best protection effectiveness on the tinplate using tin-copper alloy as substrate,nickel coating with a thickness of 1-2μm as intermediate layer,and matte tin coating with a thickness of 2-3μm as outer layer.[Conclusion]The results of this paper can provide experimental data and guidance for companies to select suitable protection technology of tinplate.

关 键 词：镀锡板 有机可焊保护剂 耐蚀性 可焊性 抗老化 

分 类 号：TQ153.13[化学工程—电化学工业]