基于共晶焊技术的高温压力传感器无引线封装技术研究  

Research on Leadless Packaging Technology of High Temperature Pressure Sensor Based on Eutectic Welding Technology

作　　者：王宇峰 王丙寅 赵艳栋 雷程[1] 梁庭[1] WANG Yufeng;WANG Bingyin;ZHAO Yandong;LEI Cheng;LIANG Ting(North University of China,Key Laboratory of Micro/nano Devices and Systems,Ministry of Education;Inner Mongolia Power Machinery Research Institute)

机构地区：[1]中北大学,微纳器件与系统教育部重点实验室 [2]内蒙古动力机械研究所

出　　处：《仪表技术与传感器》2024年第9期18-21,27,共5页Instrument Technique and Sensor

基　　金：国家重点研发计划项目(2023YFB3209100);中央引导地方科技发展资金项目(YDZJSX20231B006);山西省重点研发计划项目(202102030201001,202102030201009);山西省科技重大专项计划“揭榜挂帅”项目(202201030201004)。

摘　　要：针对MEMS高温压力传感器在高温特种环境下存在引线电学失效的不可靠性因素,制备了基于共晶焊技术的无引线封装SOI高温压阻式压力传感器。利用金锗合金焊料共晶焊接技术完成芯片与陶瓷基板的焊盘之间的连接。推力测试结果表明:其焊接强度最大值可达28.30 MPa,均值约为26.47 MPa。完成300℃环境下的老化后,其300℃高温环境下零点漂移为0.216%,时漂约为7.64μV/h。老化后常温静态压力测试线性度为0.126%,迟滞为0.136%,重复性为0.197%,均小于2‰,基本误差为0.433%。研究结果验证了金锗焊料共晶焊接制备无引线封装压力传感器的技术路线可行性。Aiming at the unreliability problem of MEMS high temperature pressure sensor with lead electrical failure in high temperature special environment,a leadless packaging SOI high temperature piezoresistive pressure sensor based on eutectic welding technology was fabricated.The metal and germanium alloy solder eutectic welding technology was used to connect the ceramic substrate and the chip pad.The thrust test results show that the maximum welding thrust strength can reach 28.30 MPa,and the average is about 26.47 MPa.After the high temperature aging work at 300℃,the zero drift at 300℃is 0.216%,and the time drift is about 7.64μV/h.After aging,the linearity of static pressure test at room temperature is 0.126%,the hysteresis is 0.136%,and the repeatability is 0.197%,all of which are less than two thousandths,and the basic error is 0.433%.The experimental results prove the feasibility of the technical route for fabricating leadless packaging pressure sensor by eutectic welding of gold-germanium solder.

关 键 词：微机电系统(MEMS) 共晶 无引线封装 高温压力传感器 二元合金 

分 类 号：TP212[自动化与计算机技术—检测技术与自动化装置]