氧化铝陶瓷基板钴活化法化学镀铜及其电磁屏蔽性能  

Electroless Copper Plating on Alumina Ceramic Substrate by Cobalt Ativation Method and Its Electromagnetic Shielding Properties

作　　者：崔开放 张祖军 王勇 陈扬杰 钟良 李刘伟 CUI Kaifang;ZHANG Zujun;WANG Yong;CHEN Yangjie;ZHONG Liang;LI Liuwei(Engineering Technology Center,Southwest University of Science and Technology,Mianyang 621010,Sichuan,China)

机构地区：[1]西南科技大学工程技术中心,四川绵阳621010

出　　处：《西南科技大学学报》2024年第3期79-85,共7页Journal of Southwest University of Science and Technology

基　　金：四川省科技厅区域创新合作项目(20zs2112);西南科技大学博士基金(19zx7165)。

摘　　要：为降低化学镀前处理工艺中贵金属离子的使用,提出了一种钴活化法化学镀铜前处理工艺。以硫酸钴为钴源,硼氢化钾为还原剂,在氧化铝陶瓷基板表面制备具有催化活性的钴微粒,最后进行化学镀铜。利用正交试验优化了钴活化工艺,通过扫描电镜观察了镀层表面形貌,利用能谱仪和X射线衍射仪分析了镀层的物相组成和晶粒状态,采用胶带法、浸锡法和矢量网络分析仪分别测试了镀层的结合力、可焊性和电磁屏蔽性能。结果表明:当硫酸钴浓度为35 g/L、硼氢化钾浓度为3.6 g/L、预活化温度为30℃、活化时间5 min时,所得镀层形貌均匀,具有良好的可焊性和结合力,平均电磁屏蔽效能可达到86.6 dB。该工艺在保证镀层性能的同时,具有良好的环境友好性。In order to reduce the use of precious metal ions in the pre-treatment process of electroless copper plating,this paper proposes a cobalt activation method for pre-treatment of electroless copper plating.Cobalt particles with catalytic activity were prepared on the surface of alumina ceramic substrate using cobalt sulfate as the cobalt source and potassium borohydride as the reducing agent,followed by chemical copper plating.The cobalt activation process was optimized by orthogonal test,the surface morphology of the plating layer was observed by scanning electron microscope,the physical phase composition and grain state of the plating layer were analyzed by energy spectrometer and X-ray diffraction analyzer,and the bonding,solderability and electromagnetic shielding properties of the plating layer were tested by adhesive tape method,immersion tin method,and vector network analyzer,respectively.The results show that when the cobalt sulfate is 35 g/L,the concentration of potassium borohydride is 3.6 g/L,the preactivation temperature is 30℃,and the activation time is 5 min,the resulting plated layer has uniform morphology,good solderability,and bonding,and the average electromagnetic shielding efficiency can reach 86.6 dB.This process has good environmental friendliness while ensuring the performance of the coating.

关 键 词：氧化铝陶瓷 钴活化 化学镀铜 可焊性 电磁屏蔽 

分 类 号：TQ150[化学工程—电化学工业] X592[环境科学与工程—环境工程]