低温固化低介电聚酰亚胺的合成及其在覆铜板上的应用  

Synthesis of Low-temperature Curing and Low-dielectric Polyimide and Its Applications on the Copper-Clad Laminates

作　　者：李桢林 胡彬扬[1] 陆佳颖 张雪平 范和平 LI Zhenlin;HU Binyang;LU Jiaying;ZHANG Xueping;FAN Heping(Hubei Institute of Chemistry,Jianghan University,Wuhan 430056,China;Haiso Technology Co.,Ltd.,Wuhan 430074,China)

机构地区：[1]江汉大学湖北省化学研究院,湖北武汉430056 [2]华烁科技股份有限公司,湖北武汉430074

出　　处：《塑料工业》2024年第9期52-56,62,共6页China Plastics Industry

基　　金：江汉大学研究生科研创新基金项目(KYCXJJ202312)。

摘　　要：为降低聚酰亚胺(PI)材料的介电性能及亚胺化温度以获得较好性能的PI覆铜板,本文采用4,4′-(六氟异丙烯)二酞酸酐(6FDA)、4,4′-二氨基二苯醚(ODA)、1,3-双(4′-氨基苯氧基)苯(TPE-R)、双酚型二醚二酐(BPADA)4种单体合成聚酰胺酸(PAA)溶液,然后向PAA溶液中引入3种可降低亚胺化温度的催化剂[喹啉(QL)、苯并咪唑(BI)、三乙胺(Et_(3)N)],在较低温下进行热亚胺化制备成PI材料,并对该材料进行热稳定性、拉伸性能、黏接性能、光学性能的表征与测试。结果表明,3种催化剂固化的PI薄膜均具有较好的热稳定性和优异的光学性能,PI/QL的拉伸强度(70.23 MPa)最佳,PI/QL的吸水率下降至0.26%,PI/Et_(3)N的介电常数(2.54)最低,PI/Et_(3)N能维持原PI的剥离强度(1.56 N/mm),3种低温固化PI的最高耐锡焊温度为296℃。To reduce the dielectric properties of polyimide(PI)materials as well as the imidisation temperature to obtain the PI copper-clad laminates with better performances,four kinds of monomers including 4,4′-(hexafluoroisopropenyl)diphthalic anhydride(6FDA),4,4′-diaminodiphenyl ether(ODA),1,3-bis(4′-aminophenoxy)benzene(TPE-R),and bisphenol polyphenol dibasic ether dianhydride(BPADA)were used to synthesize the polyamido acid(PAA)solution.Three kinds of catalysts[quinoline(QL),benzimidazole(BI),and triethylamine(Et_(3)N)]that could reduce the imidisation temperature were introduced into the PAA solution.Then the PI materials were prepared by the thermal imidisation at a lower temperature.The thermal stabilities,tensile properties,adhesive properties and optical properties of samples were characterized.The results show that the PI films cured by the three catalysts possess good thermal stability and excellent optical properties.The tensile strength(70.23 MPa)of PI/QL is the best,the water absorption of PI/QL is reduced to 0.26%,the dielectric constant(2.54)of PI/Et_(3)N is the lowest,PI/Et_(3)N is able to maintain the peel strength of the original PI(1.56 N/mm).Among the three kinds of low temperature curing PI films,the maximum soldering temperature is 296℃.

关 键 词：聚酰亚胺 低温亚胺化 催化剂 介电常数 覆铜板 

分 类 号：TQ323.7[化学工程—合成树脂塑料工业]