基于可靠性仿真的电子产品焊点寿命评估研究  

Research on the life evaluation of solder bump in electronic products based on reliability simulation

作　　者：梁志伟 汪旭 姚冲 匡芬 LIANG Zhiwei;WANG Xu;YAO Chong;KUANG Fen(CRRC Zhuzhou Institute Co.,Ltd.,Zhuzhou,Hunan 412001,China)

机构地区：[1]中车株洲电力机车研究所有限公司,湖南株洲412001

出　　处：《轨道交通材料》2024年第5期8-15,共8页Materials for Rail Transportation System

摘　　要：针对轨道交通列车用电子板卡焊点可靠性研究试验周期长、成本大等问题,提出一套完整可靠性仿真分析方法流程,对焊点可靠性及疲劳寿命开展评估,通过结构、材料参数标定和仿真模型校验提高仿真结果准确性。以某传动单元板卡为应用案例进行有限元仿真和疲劳寿命评估,并基于寿命评估结果和寿命指标要求对设计和工艺等参数进行优化改进。通过可靠性仿真可以大幅降低电子产品可靠性研究周期成本,对电子产品寿命评估和产品正向设计具有指导意义。Aiming at the problems of long testing cycle and high cost in the reliability research of the solder joints on electronic board for rail transit vehicles,a complete reliability simulation analysis flow is proposed to evaluate the reliability and fatigue life of the solder joints.The accuracy of simulation results is improved by way of structural and material parameter calibration and simulation model verification.Taking the electronic board for a transmission unit as an application case,finite element simulation and fatigue life evaluation are conducted,and the design and process parameters are optimized and improved based on the life evaluation results and life index requirements.It’s shown that the reliability simulation can dramatically reduce the reliability research cycle cost of electronic products,presenting guiding significance for the life assessment and positive design of electronic products.

关 键 词：焊点可靠性 可靠性仿真 寿命评估 温度循环 随机振动 

分 类 号：U270.381[机械工程—车辆工程]