金丝球键合第二焊点的加固工艺与可靠性研究  

Research on Reinforcement Process and Reliability of the Second Solder Joint for Gold Wire Ball Bonding

作　　者：骞涤 QIAN Di(Shaanxi Leineng Electronic Technology Co.,Ltd.,Xi’an 710199,China)

机构地区：[1]陕西雷能电子科技有限公司,西安710199

出　　处：《电子与封装》2024年第10期9-14,共6页Electronics & Packaging

摘　　要：在厚膜电路中,金丝球键合的第二焊点键合区通常由厚膜金层、铝过渡片、镀镍引线组成。键合区材料的粗糙度、缺陷尺寸及硬度等方面存在差异,对键合设备的输出精度、劈刀形貌和键合参数提出了更高要求。第二焊点采用楔形鱼尾焊工艺,容易存在脱焊、拉力强度不足的问题。因此,采用键合球在焊线上(BBOS)、补短线等工艺加固第二焊点。通过静力学分析、随机振动分析等有限元仿真方法,结合可靠性实验对不同工艺条件下的第二焊点进行分析对比,结果表明,BBOS工艺是最优选择。In the thick film circuit,the bonding area of the second solder joint of the gold wire ball bonding is usually composed of thick film gold layer,aluminum transition plate and nickel plated lead.There are differences in the roughness,defect size and hardness of the bonding area materials,which puts forward higher requirements on the output accuracy of the bonding equipment,the shape of capillary and the bonding parameters.The second solder joint adopts the wedge-shaped fishtail welding process,which is easy to have the problems of unsoldering and insufficient tensile strength.Therefore,the second solder joint is reinforced by processes such as bonding ball on stitch(BBOS)and short wire patching.Through finite element simulation methods such as static analysis and random vibration analysis,combined with reliability experiments,the second solder joints under different process conditions are analyzed and compared.The results show that BBOS process is the optimal choice.

关 键 词：封装技术 金丝球键合 第二焊点 BBOS工艺 

分 类 号：TN305.94[电子电信—物理电子学]